Photolithography

Automatic coaters & developers

Equipment
– Automatic (batch) spin-coating and development
– 100mm and 150mm wafers
– 7 photoresist dispense lines + 1 syringe line
– 2 photoresist developer lines (spray or puddle)
– HMDS vapor-prime module
– i-line resists: AZ ECI 3007, AZ 10XT-07, AZ 40XT, AZ 15nXT
– DUV resists: JSR M108Y, JSR M35G, Brewer DUV42P (BARC)
– Location: Zone 1
Documentation
Equipment Description
Responsibles
J. Dorsaz
N. Piacentini
G.-A. Racine
Equipment
– Automatic (batch) spin-coating and development
– 100mm and 150mm wafers
– 2 photoresist dispense lines + 2 syringe lines
– 2 photoresist developer lines (spray or puddle)
– Spray-coating option
– Resists: AZ 1512 HS, AZ 10XT-60, AZ nLOF2020, LOR 5A
– Location: Zone 6
Documentation
Equipment Description
Responsibles
J. Dorsaz
N. Piacentini
G.-A. Racine
Equipment
– Automatic (batch) spin-coating and development
– 100mm wafers only
– 3 photoresist dispense lines
– 2 photoresist developer lines (spray or puddle)
– Resists: AZ ECI 3007, AZ ECI 3027, AZ 10XT-20
– Location: Zone 1
Documentation
Equipment Description
Responsibles
J. Dorsaz
N. Piacentini
G.-A. Racine
Equipment
– Automatic processing of masks, i.e. chrome blanks (Cr-90nm with PR-AZ1512-500nm)
– Compatible with 4inch, 5inch, 6inch and 7inch plates
– Photoresist development, chrome etch, photoresist strip steps are run in sequence or individually.
– Location: Zone 6
Documentation
Equipment Description
Responsibles
J. Dorsaz
N. Piacentini
G.-A. Racine

Manual coater & hotplate lines

Equipment
– Programmable spin-sequence for SU-8 and polyimide
– Combi coater + 1 x HP-401Z hotplate
– Chucks for 100mm and 150mm wafers
– Manual dispense
– Location: Zone 1
Documentation
Equipment Description
Responsibles
J. Dorsaz
N. Piacentini
G.-A. Racine
Equipment
– Programmable spin-sequence for SU-8
– Combi coater + 2 x HP-200 hotplates
– Chucks for 50mm and 100mm wafers
– Chucks for small chips (min. 10x10mm2)
– Manual dispense
– Location: Zone 13
Documentation
Equipment Description
Responsibles
J. Dorsaz
N. Piacentini
G.-A. Racine
Equipment
– Programmable spin-sequence for i-line photoresists
– SB20 coater + VB20 HMDS vapor prime module
– 1 x high precision Präzitherm hotplate
– 1 x high temperature Ceran500 hotplate
– Chucks for wafers up to 200mm
– Chucks for small chips (min. 10x10mm2)
– Manual dispense
– Location: Zone 13
Documentation
Equipment Description
Responsibles
J. Dorsaz
N. Piacentini
G.-A. Racine
Equipment
– Programmable spin-sequence for polymers
– 2 x high precision Präzitherm hotplates
– Chucks for 100mm and 150mm wafers
– Adaptator ring for small chips (min. 10x10mm2)
– Manual dispense
– Location: Zone 13
Documentation
Equipment Description
Responsibles
J. Dorsaz
N. Piacentini
G.-A. Racine

Exposure tools: laser writers

Equipment
– Direct writing on Cr-blanks (4×4″ | 5×5″ | 6×6″ | 7×7″) or wafers (100mm | 150 mm).
– Batch processing. Cassette to cassette.
UV-light source (i-line λ = 355nm)
– Wizard for single or batch processing
– Wizard for dose/focus calibrations
– Advance mode for top side alignment overlay exposure
– Compatible with .gds and .cif formats
– Location: Zone 5
Documentation
Equipment Description
Layout Design
Responsibles
J. Dorsaz
N. Piacentini
G.-A. Racine
Equipment
– Direct writing on wafers and chips
– Two laser sources (λ=405nm & λ=375nm)
– Top- and backside alignment
– Wizard for dose/focus calibrations
– Compatible with .gds and .cif formats
– Location: Zone 16
Documentation
Equipment Description
Layout Design
Responsibles
J. Dorsaz
N. Piacentini
G.-A. Racine
Equipment
– 3D writing on wafers/slides/coverslips
– Two-photon absorption, laser source (λ=780nm)
– Objectives: 63x, 25x, 10x (immersion), 20x (air)
– Alignment capability
– Compatible with Nanoscribe IP- and i-line resists
– Location: Zone 16
Documentation
Equipment Description
– Online support: Nanoguide
Responsibles
J. Dorsaz
N. Piacentini
G.-A. Racine

Exposure tools: DUV (λ = 248nm) stepper

Equipment
– Step & Repeat projection stepper
– Reduction ratio: 4x
– 100mm, 150mm and 200mm wafers
– Compatible with 6″ x 0.25″ quartz reticles
– Resolution ~150nm
– Overlay accuracy <30nm
– DUV chemitry: M108Y, M35G, DUV42P
– Location: Zone 5
Documentation
Equipment Description
Responsibles
J. Dorsaz
N. Piacentini
G.-A. Racine

Exposure tools: mask-aligners

Equipment
– Exposure with top-side alignment
– i-line illumination (365nm)
– Multiple wafer/chip sizes up to 100mm wafer
– Holders for Cr masks and transparent foils
– Dedicated chuck and objectives for chips
– Location: Zone 13
Documentation
Equipment Description
Responsibles
J. Dorsaz
N. Piacentini
G.-A. Racine
Equipment
– Exposure with top-side or back-side alignment
– Broadband illumination
– Multiple wafer sizes up to 150mm wafer
– Option for bond (wafer to wafer) alignment
– Location: Zone 6
Documentation
Equipment Description
Responsibles
J. Dorsaz
N. Piacentini
G.-A. Racine
Equipment
– Exposure with top-side or back-side alignment
– Configurable illumination (i-line, broadband, DUV)
– Multiple wafer/chip sizes up to 150mm wafer
– Option for grayscale and talbot exposure
– Location: Zone 1
Documentation
Equipment Description
Responsibles
J. Dorsaz
N. Piacentini
G.-A. Racine

Photolithography wet benches

Equipment
– Wet bench for lift-off of wafer batches
– 4x NMP bath (one with US agitation)
– 1x IPA bath
– Wet bench for SU-8 development
– 2x DI H2O baths
– Spin, rinse & dry (SRD) module
– Location: Zone 1
Documentation
Equipment Description
Responsibles
J. Dorsaz
N. Piacentini
G.-A. Racine
Equipment
– Wet bench for wet stripping of wafer batches
– 2x heated SVC-14 baths (68°C)
– 1x Technistrip P1316 bath
– 2x DI H2O baths
– BLE drying spinner module
– Location: Zone 6
Documentation
Equipment Description
Responsibles
J. Dorsaz
N. Piacentini
G.-A. Racine
Equipment
– Wet bench for solvent chemistry with beakers
– Various beaker sizes and substrate holders
– Solvents : acetone, IPA, PGMEA, Remover 1165, SVC-14
– DI H2O sinks with spray showers
– 2x Bain-Marie with heating and ultrasonic options
– Location: Zone 13
Documentation
Equipment Description
Responsibles
J. Dorsaz
N. Piacentini
G.-A. Racine
Equipment
– Wet bench for bases (developers) with beakers
– Various beaker sizes and substrate holders
– Developers: AZ 400K, AZ 351 B, AZ 726 MIF, AZ developer
– DI H2O sinks with spray showers
– Centralized waste
– Location: Zone 13
Documentation
Equipment Description
Responsibles
J. Dorsaz
N. Piacentini
G.-A. Racine
Equipment
– Wet bench for solvent chemistry with beakers
– Quickstick cleaning
– VM651 and HD3000 silane processes
– 2x DI H2O baths
– 1x BLE drying spinner module
– Location: Zone 6
Documentation
Equipment Description
Responsibles
J. Dorsaz
N. Piacentini
G.-A. Racine

Additional hot plates / ovens

Equipment
– Oven for deposition of HMDS primer
– Carriers for 100mm and 150mm wafers
– Process temperature : 125°C
– Location: Zone 1 and Zone 6
Documentation
Equipment Description
Responsibles
J. Dorsaz
N. Piacentini
G.-A. Racine
Equipment
– Programmable, large-area hot plate
– Up to 9 wafers in a batch
– Dedicated to SU-8 PEB and hardbake
– No exhaust – softbake is forbidden with this hotplate
– Location: Zone 1
Documentation
Equipment Description
Responsibles
J. Dorsaz
N. Piacentini
G.-A. Racine
Equipment
– Programmable, large-area hot plate
– Up to 4 wafers in a batch
– Dedicated to SU-8 softbake, PEB and hardbake
– Location: Zone 1
Documentation
Equipment Description
Responsibles
J. Dorsaz
N. Piacentini
G.-A. Racine
Equipment




Documentation
– User manual
Responsibles
J. Dorsaz
N. Piacentini
G.-A. Racine
Equipment




Documentation
– User manual
Responsibles
J. Dorsaz
N. Piacentini
G.-A. Racine