Metrology

AFM

Equipement: – 150mm X 180mm inspectable area with rotating chuck
– Automated laser and detector alignment
– <30pm vertical noise with closed-loop Icon scanner
– High speed imaging with FastScan scanner
– Location: Zone 15
Documentation: – Manual
Responsibles: D. Bouvet
R. Juttin

FIB / SEM / EDX / ProSEM

Equipement: – 100, 150 mm wafers and piece parts
– High resolution SEM imaging
– Ion beam patterning (> 100nm)
– Up to 30 kV SEM and FIB acceleration voltages
– Cross-sections, TEM lamellas, Omniprobe manipulator
– Location: Zone 8
Documentation: – Manual
Responsibles: Z. Benes
J. Pernollet

Equipement: – 100, 150 mm wafers, cleaved samples and piece parts
– High resolution SEM imaging (~5nm)
– From 0.5 to 10 kV acceleration voltage
– Location: Zone 1
Documentation: – Manual
Responsibles: Z. Benes
J. Pernollet

Equipement: – 100 wafers, cleaved samples and piece parts
– High resolution SEM imaging (<1nm)
– From 0.02 to 30 kV acceleration voltage
– SE, In-Lens and Energy Selective Backscatter detectors
– EDX Analysis
– Location: Zone 15
Documentation: – Manual
Responsibles: Z. Benes
J. Pernollet

Equipement: – Energy Dispersive X-ray Spectroscopy
– Oxford Instruments X-MAX silicon drift type detector 50mm2
– Resolution 127eV FWHM
– Detection limit about 1 atomic %
– AZtec and INCA software
– Location: Zone 15
Documentation: – Manual
Responsibles: Z. Benes
J. Pernollet

Equipement: – GenISysSEM image analysis software
– CD and line-edge roughness measurements
– Automatic pattern edge detection
– Multiple features in a single image analysis
– Batch processing of multiple images
– Location: BM1132
Documentation: – Manual
Responsibles: Z. Benes
J. Pernollet

XPS / AES available at MHMC

Please visit “Surface characterization” MHMC page for more details.

Please visit “Surface characterization” MHMC page for more details.

Mechanical profilometers

Equipement: – Measurement range in Z : 10 nm to 300 µm
– Spacial resolution : 10 µm
– Location: Zone 15
Documentation: – Manual
Responsibles: G. Clerc

Equipement: – Measurement range in Z : up to 1mm
– Step height repeatability: 5A
– 3D stress and 3D mapping
– Location: Zone 4
Documentation: – Manual
– Tutorial for database
Responsibles: D. Bouvet
A. Toros

Equipement: Measurement range in Z : up to 1mm

Step height repeatability: 20A

– Measurement range in Z : up to 1mm
– Step height repeatability: 20A
– Location: Zone 19
Documentation: – Manual
Responsibles: D. Bouvet
A. Toros

Optical measurement

Equipement: – Contact Angle and Surface Free Energy (SFE) measurements
– Multi-dosing system (4 automatic and 1 manual syringes)
– Motor-controlled y– axis for multi-drop experiments
– Droplet volume < 5 µl
– Location: Zone 16
Documentation: – Equipment Description
Responsibles: J. Dorsaz

Equipement: – Measurement range : 1 nm and more
– Multi-layers measurements
– Standard spot diameter : 1 to 5 mm
– Micro spot diameter : 500 µm
– Location: Zone 3
Documentation: – Manual
Responsibles: R. Juttin
D. Bouvet

Equipement: – Measurement range : 1 nm and more
– Multi-layers measurements
– Spectral range: 210nm to 2500nm
– Location: Zone 4
Documentation: – Manual
Responsibles: R. Juttin
B. Cuénod

Equipement: – Phase shifting interferometry (PSI) for roughness and small steps (< 135 nm)
– Vertical scanning interferometry (VSI) for rough surface and steps up to 10 mm high
– PSI vertical resolution : <0.01 nm
– VSI vertical resolution : <0.75 %
– Spacial resolution : 0.38 µm
– Location: Zone 15
Documentation: – Manual
Responsibles: C. Hibert
A. Toros

Equipement: – Measurement range : 10nm up to 20µm
– Spatial resolution : 10µm and wider (spot size depends on objective magnification 4x: 62.5µm, 10x: 25µm, 40x: 6.25µm)
– Mono, bi-layers and tri-layer stack measurements
– Location: Zone 19
Documentation: – Manual
Responsibles: J. Dorsaz
G.A. Racine
G. Clerc

Equipement: – Thickness measurement
– Thickness range : 1nm to 40µm
– Thickness and n and k measurement
– Thickness range : 50nm and up
– Wavelength range : 200nm – 1100nm
– Spot size : 1.5mm
– Measurement of Single layers
– Measurement of Multilayer stacks
– Location: Zone 15
Documentation: – Manual
Responsibles: J. Dorsaz
G.A. Racine

Filmetrics F54

Equipement: – Measurement range : 10nm up to 40µm
– Spatial resolution : 33µm (500um aperture)
– Mono, bi-layers and tri-layer stack measurements
– Location: Zone 3
Documentation: – Manual
Responsibles: N. Piacentini
J. Dorsaz
G.A. Racine
R. Juttin

Equipement: – Thin film stress measurement
– Location: Zone 15
Documentation: – Manual
Responsibles: C. Hibert

Equipement: – Location: BM 0235
Documentation: – Brochure
Responsibles: Rui Ning Wang

Electrical measurement

Equipement: – DC electrical measurements with up to 4 probes
– Tungsten tips with 12 and 7 µm radius
– Stage travel with fine and coarse mode, up to 150mm x 150mm
– Configurations for resistivity, diode, FET and Bipolar transistors
– Location: Zone 11
Documentation: – Equipment Description
Responsibles: G.A. Racine

Equipement: – Compatible layers : Metal, Conductive Oxide, Silicon and Polysilicon.
The tool is configured by default for the metallic layers and for sample thickness of 525 um +/- 25 um.
If you are not in this configuration, please contact CMi staff
– Measurement range : 5 mOhm/sq to 5MOhm/sq
– Measurement area : 10x 10 to 200 x 200 mm
– Accuracy : +/- 1%
– Repeatability : < 0.5 %
– Temperature compensation
– 2D and 3D mapping
– Location: Zone 4
Documentation: – Manual
Responsibles: D. Bouvet
A. Toros

Optical microscopy

Equipements: – List of microscopes at CMi
Documentation: – Manual Leica D800