– 100mm wafer size bonding – 3 mbar vacuum – N2 Purge – Voltage max 1000V – Max Temperature 450 °C. – Motorized z-axis, pneumatic and simultaneous spacers and clamps movements – Location: Zone 6
– 193nm ArF, up to 10J/cm2 – Mainly polymers (PMMA, PC, Polyimide, PET…) – Samples of various shapes and sizes – Travel range 130mm X 130mm – Built-in solutions for matrix processes, grooves creator – Jobs recipes handling – DXF converter – Location: Zone 18/19
– 100, 150 mm wafers – Silicon, glass and pyrex wafers – Other materials on demand – Maximum thickness 1 mm on silicon and 2.4 mm on glass and pyrex – Location: Zone 9
– Vertically air-pressurized cylinder – Temperature up to 200 °C – Imprinting intensity up to 3 kN – Imprinting area up to 150×150 mm – Location: Zone 11
– Hot rolls laminators – Accurately controlled heat, pressure, speed – Quick and easy wafer processing – ALPHA940 and ALPHA920 dry films – Location: back of Zone 1
– Not microelectronic, not biocompatible compatible – Temperature range: 150 to 1000°C – Maximum heating and cooling rate : 100°C/min – Chamber with gas extraction – Sweeping gas available: N2 or forming gas (3% H2 in N2) – Vacuum for purge cycles – Sample size: 10 alumina 5inch square plates available, possibility to load 10 wafers 100mm in diam. – Location: Zone 10
– Not microelectronic, not biocompatible compatible vaccumed chamber: less than 5 mbar – Temperature range: 50 to 450°C – Maximum heating: 200°C/min – Maximum cooling rate : 100°C/min – Chamber with gas extraction – Process chamber size: 147mm x 217mm height 40mm – Location: Zone 10
