– High accuracy Flip-Chip bonder (Post-bond accuracy +/- 0.5 um) – Thermocompression and ultrasonic technologies – Force : 0.2 to 10 N – Heating up to 450°C – Adhesive dispenser – Automatic alignment and calibration – Chip size (Upper die) : up to 22 mm x 22 mm – Substrate size (Lower die) : up to 100 mm x 100 mm – Total thickness : up to 10 mm – Location: Zone 5
– 100, 150 mm wafers – Non-contact Setup – Blade breakage detector – Circle cut for edge trimming or down sizing – CO2 injector to prevent particle adhesion and electrostatic discharge damage – Pattern recognition system – Automatic micro-alignment – Location: Zone 22
– 100, 150 mm wafers – Silicon, glass and pyrex wafers – Other materials on demand – Maximum thickness 1 mm on silicon and 2.4 mm on glass and pyrex – Location: Zone 22
Thermal NIL up to 250°C UV NIL @365nm or 405nm (with temperature up to 200°C) Imprint in vacuum (~1mbar) Uniform pressure (up to 6.5bar) applied trough a membrane Replicable structures : ~40nm up to 100um
– Vertically air-pressurized cylinder – Temperature up to 200 °C – Imprinting intensity up to 3 kN – Imprinting area up to 150×150 mm – Location: Zone 11
Quick stick 135 is a wax used for temporary sticking of a wafer, or pieces of wafer, on a dummy wafer in order to make processing like photolithography or etching.
It is mainly used for: – Photolithography on fragile wafer or wafer with holes or deep cavities on back side – Dry etching on chips
– Hot rolls laminators – Accurately controlled heat, pressure, speed – Quick and easy wafer processing – ALPHA940 and ALPHA920 dry films – Location: back of Zone 1
– Not microelectronic, not biocompatible compatible – Temperature range: 150 to 1000°C – Maximum heating rate : 50°C/min – Maximum cooling rate : 10°C/min – Chamber with gas extraction – Sweeping gas available: N2 or forming gas (3% H2 in N2) – Vacuum for purge cycles – Sample size: 10 alumina 5inch square plates available, possibility to load 10 wafers 100mm in diam. – Location: PH C2 402
