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Center of MicroNanoTechnology
Equipment
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Wire Bonding
TPT HB10
TPT HB10
Center of MicroNanoTechnology
Back: Center of MicroNanoTechnology
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Back: Organisation
About CMi
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Back: Access & Security
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Back: Staff
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Back: Processing fees
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Picture of the Month
Back: Picture of the Month
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Honorable 2023
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News & Events
Equipment
Back: Equipment
Ebeam lithography
Back: Ebeam lithography
Raith EBPG5000 – Ebeam tool
Back: Raith EBPG5000 – Ebeam tool
Administration
Fundamental principles
Back: Fundamental principles
Tool Description
Writing Strategy
Conductive Substrate
Opaque Reflective Surface
Alignment
Data Preparation
Back: Data Preparation
CATS
BEAMER
CJOB
Batch_job
Ebeam Resists
Back: Ebeam Resists
MMA / PMMA
ZEP 520A
CSAR 62
HSQ / FOX16
nLOF
Electra 92
Operation Manuals
Back: Operation Manuals
Control Computer
Holders
Alignment Microscope
Loading & Unloading
Tips
Back: Tips
Keep It Simple
What NOT To Do
Sawatec SM-150 for ebeam resists
Sawatec HP-200 hot plates
Plade Solvents wet bench
Water / Base wet bench
Präziterm hot plate
Terra universal nitrogen cabinet
Photolithography
Back: Photolithography
DUV (λ = 248nm) inline track & stepper
Back: DUV (λ = 248nm) inline track & stepper
ASML PAS 5500/350C
Back: ASML PAS 5500/350C
ASML 4x reticle template
ASML 4x reticle visual guide
ASML 4x reticle design guide
TEL Clean Track ACT-8
Automatic coaters and developers
Back: Automatic coaters and developers
Süss ACS200 GEN3
EVG 150
Hamatech HMR900
Manual coaters
Back: Manual coaters
Sawatec SM-200 for photoresists
Back: Sawatec SM-200 for photoresists
Sawatec SM-200 Manual
Sawatec LSM-250 & HP-200
Back: Sawatec LSM-250 & HP-200
Sawatec LSM-250 & HP-200 Manual
Sawatec LSM-200 & HP-401-Z
Back: Sawatec LSM-200 & HP-401-Z
Sawatec LSM-200 & HP-401-Z Manual
Sawatec LSM-250 for MISC polymers
Back: Sawatec LSM-250 for MISC polymers
Sawatec LSM-250 MISC Manual
Exposure tools: laser writers
Back: Exposure tools: laser writers
Heidelberg Instruments VPG200
Heidelberg Instruments MLA150 – 1 & 2
Back: Heidelberg Instruments MLA150 – 1 & 2
MLA150 Manual
HIMT “convert” Manual (MLA150)
Nanoscribe Photonic Professional GT+
Back: Nanoscribe Photonic Professional GT+
Nanoscribe PPGT+ Manual
Nanoscribe Alignment Manual
Describe Manual
Exposure tools: mask-aligners
Back: Exposure tools: mask-aligners
Süss MA6Gen3
Back: Süss MA6Gen3
MA6 Gen3 Manual
MA6 Gen3 Assisted Alignment Manual
MA6 Gen3 Film Masks Manual
Süss MA6/BA6
Back: Süss MA6/BA6
MA6 Manual
BA6 Manual
Süss MJB4
Back: Süss MJB4
MJB4 Manual
Nanoimprint Lithography
Back: Nanoimprint Lithography
NILT CNI v3.0
Photolithography wet benches
Back: Photolithography wet benches
Plade Solvent Z01
Back: Plade Solvent Z01
Plade Solvent, Lift-off Manual
Arias Solvent Z13
Arias Base Z13
Arias “Lift-off” Z12
Additional hot plates / ovens
Back: Additional hot plates / ovens
YES 310TA, Vacuum cure & HMDS vapor prime oven
Heraeus T6060, multipurpose oven
Despatch LCD1-16NV-3, biocompatible oven
Etching
Back: Etching
Ion Beam Etching
Back: Ion Beam Etching
Veeco Nexus IBE350
Plasma Etching
Back: Plasma Etching
STS Multiplex ICP
Alcatel AMS 200 SE
SPTS APS
TEL Unity Me
SPTS Rapier
Oxford – PlasmaPro100 Cobra
Resist Strip and Descum
Back: Resist Strip and Descum
Oxford PRS900
Tepla 300
Tepla GiGAbatch
ESI 3511 Downstream Plasma Asher
Jelight UVO Cleaner
Gas Etching
Back: Gas Etching
SPTS uEtch
SPTS Xactix X4 – XeF2 Silicon etching system
Grinding / Polishing
Back: Grinding / Polishing
STEAG MECAPOL 460 – CMP (CHEMICAL MECHANICAL POLISHING)
Alpsitec E460 F – CMP (Chemical Mechanical Polishing)
Post CMP Cleaning System GnP Cleaner 428
DAG810 – AUTOMATIC SURFACE GRINDER
Wet Etching
Back: Wet Etching
UFT Piranha
UFT Resist
Plade Oxide
Plade Metal
Plade Six Sigma KOH
Back: Plade Six Sigma KOH
Protek Protective Stop Layer
Tousimis Automegasamdri 915B – Critical Point Dryer
Arias Acid
Arias Base #1 & #2
Solvent bench Z14
Thin films
Back: Thin films
LPCVD / Dry or wet oxidation / Alloying / Doping / Diffusion / Densification / Annealing / ALD
Back: LPCVD / Dry or wet oxidation / Alloying / Doping / Diffusion / Densification / Annealing / ALD
Centrotherm furnaces
Plade RCA
ATOMIC LAYER DEPOSITION BENEQ TFS200 (ALD 1)
ATOMIC LAYER DEPOSITION BENEQ TFS200 (ALD 2)
RTP JETFIRST 200
ROVAK Flash Lamp Annealing System Semi-Line 3.0
PECVD
Back: PECVD
Oxford Instruments PlasmaPro 100 ICPCVD
Corial D250L PECVD
Evaporation
Back: Evaporation
Alliance-Concept EVA 760
Back: Alliance-Concept EVA 760
User Manual
Recipes
Steps
References
Available PVD targets in CMi
Precious material billing
Leybold Optics LAB 600H
Back: Leybold Optics LAB 600H
User Manual
Recipes
Recipe Categories
Available PVD targets in CMi
Processing fees
Bühler Alzenau LTE – Long Throw Evaporator
Vacotec
Vacotec VACO 250
Back: Vacotec VACO 250
User Manual
Boats
Plassys MEB550SL3 UHV Evaporator
Sputtering
Back: Sputtering
Pfeiffer SPIDER 600
Back: Pfeiffer SPIDER 600
Recipes
User Manual
Available PVD targets in CMi
Precious material billing
Alliance-Concept DP 650
Back: Alliance-Concept DP 650
Recipes
Steps
Measurement Ref.
User Manual
Available PVD targets in CMi
Precious material billing
Pulsed Laser Deposition
Back: Pulsed Laser Deposition
Solmates SMP 800
Back: Solmates SMP 800
Available PVD targets in CMi
Electroplating / Parylene coating
Back: Electroplating / Parylene coating
Silicet Electroplating unit, Cu
Comelec C-30-S
Metrology
Back: Metrology
AFM
Back: AFM
Bruker FastScan AFM
FIB / SEM / EDX / ProSEM
Back: FIB / SEM / EDX / ProSEM
FEI Nova 600 NanoLab
Zeiss LEO 1550
Zeiss MERLIN
EDX
Zeiss SEM Crossbeam 550
ProSEM software
XPS / AES available at MHMC
Mechanical profilometers
Back: Mechanical profilometers
KLA Tencor P-17
Bruker Dektak XT
KLA Tencor D600
Optical measurement
Back: Optical measurement
Krüss DSA-30E
Back: Krüss DSA-30E
Krüss DSA-30E Manual
Krüss / ImageJ Surface Tension Manual
Krüss Surface Free Energy Models
Sopra GES 5E
Woollam RC2
Bruker Contour X
Nanospec AFT-6100
FilMetrics F20-UV
Filmetrics F54
Toho Technology FLX 2320-S
Electrical measurement
Back: Electrical measurement
Filmetrics R50 – 200 – 4PP
AIT CMT-SR2000N 4-Point Probe Measurement System
MPI TS150 Probe Station
Back: MPI TS150 Probe Station
MPI TS150 probe station Manual
Optical microscopy
Back: Optical microscopy
Microscopes at CMi
Back: Microscopes at CMi
Leica DM8000
Nikon Optiphot 200, inspection microscope
Nikon Optiphot 150, inspection microscope
Nikon MM 40, inspection and 2-D metrology microscope
Mitutoyo, inspection microscope
Nikon Eclipse LV150 microscope
Packaging – Miscellaneous
Back: Packaging – Miscellaneous
Wafer Bonding
Back: Wafer Bonding
EVG 510, wafer to wafer bonding line
Wire Bonding
Back: Wire Bonding
TPT HB10
F&S Bondtec 56i
Die Bonding
Back: Die Bonding
Finetech FINEPLACER lambda, Die Bonder
Laser Machining – Milling
Back: Laser Machining – Milling
OPTEC LSV3
T-Tech QC5000S-E
Dicing – Cutting
Back: Dicing – Cutting
Disco DAD321
Graphtec RoboPro CE5000-40-CRP
Printing
Back: Printing
NanoImprint EHN-3250
Miscellaneous
Back: Miscellaneous
PDMS line
Dry Film Laminators
Surfx Atomflo 400L
Idonus shadow mask aligner
Neytech Qex Furnace
Furnace ATV PEO-601
Furnace ATV SRO-702
III/V Lab – IPHYS
Process
Back: Process
Ebeam Lithography
Photolithography
Back: Photolithography
Layout Editors & Templates
Mask/Reticle Fabrication
Photoresists available in CMi
Back: Photoresists available in CMi
AZ 1512 HS
Back: AZ 1512 HS
AZ 1512 HS Datasheet
AZ ECI 3007
Back: AZ ECI 3007
AZ ECI 3007 Datasheet
AZ ECI 3027
Back: AZ ECI 3027
AZ ECI 3027 Datasheet
AZ 10XT-07
Back: AZ 10XT-07
AZ 10XT-07 Datasheet
AZ 10XT-20
Back: AZ 10XT-20
AZ 10XT-20 Datasheet
AZ 10XT-60
Back: AZ 10XT-60
AZ 10XT-60 Datasheet
AZ 40XT
Back: AZ 40XT
AZ 40-XT Datasheet
LOR 5A / AZ 1512 HS
Back: LOR 5A / AZ 1512 HS
LOR 5A Datasheet
AZ NLOF 2020
Back: AZ NLOF 2020
AZ nLOF 2020 Datasheet
AZ 15nXT
SU-8
M108Y
Back: M108Y
M108Y Datasheet
M35G
Back: M35G
M35G Datasheet
PI 2610 & PI 2611
Photolithography on chips < 5mm * 5mm
Thin films
Back: Thin films
Available PVD targets in CMi
PVD definitions
Materials
Back: Materials
Silicon Wafers
SOI Wafers
Glass Wafers
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