Skip to content
Logo EPFL, École polytechnique fédérale de Lausanne
  • About
  • Education
  • Research
  • Innovation
  • Schools
  • Campus
Show / hide the search form
Hide the search form
  • EN
  2. Research
  3. EPFL Research Facilities
  4. Center of MicroNanoTechnology
  5. Organisation

Organisation

About CMi
Become a CMi member
Access & Security
Staff
Phone numbers
Processing fees
Cleanroom photo gallery
Picture of the Month
Partners & Links
Projects
News & Events
  • Center of MicroNanoTechnology
    • Back: Center of MicroNanoTechnology
    • Reservations
    • Organisation
      • Back: Organisation
      • About CMi
      • Become a CMi member
      • Access & Security
        • Back: Access & Security
        • How to access CMi cleanrooms
        • Materials introduction in CMi cleanrooms
        • IT rules in CMi
        • Safety Rules
        • Emergency procedures
      • Staff
        • Back: Staff
        • Photo Gallery
        • Organization chart
      • Phone numbers
      • Processing fees
        • Back: Processing fees
        • Invoiced fees & User status
        • Penalties rules
        • Precious material
        • Refund demand
        • CMi Services
        • General rates – CMi user account required
      • Partners & Links
      • Projects
      • Cleanroom photo gallery
      • Picture of the Month
        • Back: Picture of the Month
        • Rules for Submission
        • Honorable Runner-ups
        • Winners 2022
        • Winners 2021
        • Winners 2020
        • Winners 2019
        • Winners 2018
        • Winners 2017
        • Winners 2016
        • Honorable 2022
        • Honorable 2021
        • Honorable 2020
        • Honorable 2019
        • Honorable 2018
        • Honorable 2017
        • Honorable 2016
      • News & Events
    • Equipment
      • Back: Equipment
      • Ebeam lithography
        • Back: Ebeam lithography
        • Raith EBPG5000 – Ebeam tool
          • Back: Raith EBPG5000 – Ebeam tool
          • Administration
          • Fundamental principles
            • Back: Fundamental principles
            • Tool Description
            • Writing Strategy
            • Conductive Substrate
            • Opaque Reflective Surface
            • Alignment
          • Data Preparation
            • Back: Data Preparation
            • CATS
            • BEAMER
            • CJOB
            • Batch_job
          • Ebeam Resists
            • Back: Ebeam Resists
            • MMA / PMMA
            • ZEP 520A
            • CSAR 62
            • HSQ / FOX16
            • nLOF
            • Electra 92
          • Operation Manuals
            • Back: Operation Manuals
            • Control Computer
            • Holders
            • Alignment Microscope
            • Loading & Unloading
          • Tips
            • Back: Tips
            • Keep It Simple
            • What NOT To Do
        • Sawatec SM-150 for ebeam resists
        • Sawatec HP-200 hot plates
        • Plade Solvents wet bench
        • Water / Base wet bench
        • Präziterm hot plate
        • Terra universal nitrogen cabinet
      • Photolithography
        • Back: Photolithography
        • DUV (λ = 248nm) inline track & stepper
          • Back: DUV (λ = 248nm) inline track & stepper
          • ASML PAS 5500/350C
            • Back: ASML PAS 5500/350C
            • ASML 4x reticle template
            • ASML 4x reticle visual guide
            • ASML 4x reticle design guide
          • TEL Clean Track ACT-8
        • Automatic coaters and developers
          • Back: Automatic coaters and developers
          • Süss ACS200 GEN3
          • EVG 150 – AUTOMATIC RESIST PROCESSING CLUSTER
          • RITETRACK 88 SERIES – AUTOMATIC COATER AND DEVELOPER TRACKS
          • Hamatech HMR900
        • Manual coaters
          • Back: Manual coaters
          • Sawatec SM-200 for photoresists
            • Back: Sawatec SM-200 for photoresists
            • Sawatec SM-200 Manual
          • Sawatec LSM-250 & HP-200
            • Back: Sawatec LSM-250 & HP-200
            • Sawatec LSM-250 & HP-200 Manual
          • Sawatec LSM-200 & HP-401-Z
            • Back: Sawatec LSM-200 & HP-401-Z
            • Sawatec LSM-200 & HP-401-Z Manual
          • Sawatec LSM-250 for MISC polymers
            • Back: Sawatec LSM-250 for MISC polymers
            • Sawatec LSM-250 MISC Manual
        • Exposure tools: laser writers
          • Back: Exposure tools: laser writers
          • Heidelberg Instruments VPG200
          • Heidelberg Instruments MLA150 – 1 & 2
            • Back: Heidelberg Instruments MLA150 – 1 & 2
            • MLA150 Manual
            • HIMT “convert” Manual (MLA150)
          • Nanoscribe Photonic Professional GT+
            • Back: Nanoscribe Photonic Professional GT+
            • Nanoscribe PPGT+ Manual
            • Nanoscribe Alignment Manual
            • Describe Manual
        • Exposure tools: mask-aligners
          • Back: Exposure tools: mask-aligners
          • Süss MA6Gen3
            • Back: Süss MA6Gen3
            • MA6 Gen3 Manual
            • MA6 Gen3 Assisted Alignment Manual
            • MA6 Gen3 Film Masks Manual
          • Süss MA6/BA6
            • Back: Süss MA6/BA6
            • MA6 Manual
            • BA6 Manual
          • Süss MJB4
            • Back: Süss MJB4
            • MJB4 Manual
        • Nanoimprint Lithography
          • Back: Nanoimprint Lithography
          • NILT CNI v3.0
        • Photolithography wet benches
          • Back: Photolithography wet benches
          • Plade Solvent Z01
            • Back: Plade Solvent Z01
            • Plade Solvent, Lift-off Manual
          • Coillard Solvent Z06
          • Plade Solvent Z06
          • Arias Solvent Z13
          • Arias Base Z13
          • Arias “Lift-off” Z12
        • Additional hot plates / ovens
          • Back: Additional hot plates / ovens
          • YES 310TA, Vacuum cure & HMDS vapor prime oven
          • Accuplate, hotplate for SU-8 PEB and hardbake
            • Back: Accuplate, hotplate for SU-8 PEB and hardbake
            • Accuplate Manual
          • Dataplate, hotplate for SU-8 softbake, PEB or hardbake
            • Back: Dataplate, hotplate for SU-8 softbake, PEB or hardbake
            • Dataplate Manual
          • Heraeus T6060, multipurpose oven
          • Despatch LCD1-16NV-3, biocompatible oven
      • Etching
        • Back: Etching
        • Ion Beam Etching
          • Back: Ion Beam Etching
          • Veeco Nexus IBE350
        • Plasma Etching
          • Back: Plasma Etching
          • STS Multiplex ICP
          • Alcatel AMS 200 SE
          • SPTS APS
          • TEL Unity Me
          • SPTS Rapier
          • Oxford – PlasmaPro100 Cobra
        • Resist Strip and Descum
          • Back: Resist Strip and Descum
          • Oxford PRS900
          • Tepla 300
          • Tepla GiGAbatch
          • ESI 3511 Downstream Plasma Asher
          • Jelight UVO Cleaner
        • Gas Etching
          • Back: Gas Etching
          • SPTS uEtch
          • SPTS Xactix X4 – XeF2 Silicon etching system
        • Grinding / Polishing
          • Back: Grinding / Polishing
          • STEAG MECAPOL 460 – CMP (CHEMICAL MECHANICAL POLISHING)
          • Alpsitec E460 F – CMP (Chemical Mechanical Polishing)
          • Post CMP Cleaning System GnP Cleaner 428
          • DAG810 – AUTOMATIC SURFACE GRINDER
        • Wet Etching
          • Back: Wet Etching
          • UFT Piranha
          • UFT Resist
          • Plade Oxide
          • Plade Metal
          • Plade Six Sigma KOH
            • Back: Plade Six Sigma KOH
            • Protek Protective Stop Layer
          • Tousimis Automegasamdri 915B – Critical Point Dryer
          • Arias Acid
          • Arias Base #1 & #2
          • Solvent bench Z14
      • Thin films
        • Back: Thin films
        • LPCVD / Dry or wet oxidation / Alloying / Doping / Diffusion / Densification / Annealing / ALD
          • Back: LPCVD / Dry or wet oxidation / Alloying / Doping / Diffusion / Densification / Annealing / ALD
          • Centrotherm furnaces
          • Plade RCA
          • ATOMIC LAYER DEPOSITION BENEQ TFS200 (ALD 1)
          • ATOMIC LAYER DEPOSITION BENEQ TFS200 (ALD 2)
          • RTP JETFIRST 200
          • ROVAK Flash Lamp Annealing System Semi-Line 3.0
        • PECVD
          • Back: PECVD
          • Oxford Instruments PlasmaPro 100 ICPCVD
          • Corial D250L PECVD
        • Evaporation
          • Back: Evaporation
          • Alliance-Concept EVA 760
            • Back: Alliance-Concept EVA 760
            • User Manual
            • Recipes
            • Steps
            • References
            • Available PVD targets in CMi
            • Precious material billing
          • Leybold Optics LAB 600H
            • Back: Leybold Optics LAB 600H
            • User Manual
            • Recipes
            • Recipe Categories
            • Available PVD targets in CMi
            • Processing fees
          • Vacotec
          • Vacotec VACO 250
            • Back: Vacotec VACO 250
            • User Manual
            • Boats
          • Plassys MEB550SL3 UHV Evaporator
        • Sputtering
          • Back: Sputtering
          • Pfeiffer SPIDER 600
            • Back: Pfeiffer SPIDER 600
            • Recipes
            • User Manual
            • Available PVD targets in CMi
            • Precious material billing
          • Alliance-Concept DP 650
            • Back: Alliance-Concept DP 650
            • Recipes
            • Steps
            • Measurement Ref.
            • User Manual
            • Available PVD targets in CMi
            • Precious material billing
        • Pulsed Laser Deposition
          • Back: Pulsed Laser Deposition
          • Solmates SMP 800
            • Back: Solmates SMP 800
            • Available PVD targets in CMi
        • Electroplating / Parylene coating
          • Back: Electroplating / Parylene coating
          • Silicet Electroplating unit, Cu
          • Comelec C-30-S
      • Metrology
        • Back: Metrology
        • AFM
          • Back: AFM
          • Bruker FastScan AFM
        • FIB / SEM / EDX / ProSEM
          • Back: FIB / SEM / EDX / ProSEM
          • FEI Nova 600 NanoLab
          • Zeiss LEO 1550
          • Zeiss MERLIN
          • EDX
          • Zeiss SEM Crossbeam 550
          • ProSEM software
        • XPS / AES available at MHMC
        • Mechanical profilometers
          • Back: Mechanical profilometers
          • KLA Tencor P-17
          • Bruker Dektak XT
          • KLA Tencor D600
        • Optical measurement
          • Back: Optical measurement
          • Krüss DSA-30E
            • Back: Krüss DSA-30E
            • Krüss DSA-30E Manual
            • Krüss / ImageJ Surface Tension Manual
            • Krüss Surface Free Energy Models
          • Sopra GES 5E
          • Woollam RC2
          • Bruker Contour X
          • Nanospec AFT-6100
          • FilMetrics F20-UV
          • Filmetrics F54
          • Toho Technology FLX 2320-S
        • Electrical measurement
          • Back: Electrical measurement
          • Filmetrics R50 – 200 – 4PP
          • AIT CMT-SR2000N 4-Point Probe Measurement System
          • MPI TS150 Probe Station
            • Back: MPI TS150 Probe Station
            • MPI TS150 probe station Manual
        • Optical microscopy
          • Back: Optical microscopy
          • Microscopes at CMi
            • Back: Microscopes at CMi
            • Leica DM8000
            • Nikon Optiphot 200, inspection microscope
            • Nikon Optiphot 150, inspection microscope
            • Nikon MM 40, inspection and 2-D metrology microscope
            • Mitutoyo, inspection microscope
            • Nikon Eclipse LV150 microscope
      • Packaging – Miscellaneous
        • Back: Packaging – Miscellaneous
        • Wafer Bonding
          • Back: Wafer Bonding
          • Süss SB6
            • Back: Süss SB6
            • Süss SB6 Manual
        • Wire Bonding
          • Back: Wire Bonding
          • TPT HB10
          • F&S Bondtec 56i
        • Die Bonding
          • Back: Die Bonding
          • Finetech FINEPLACER lambda, Die Bonder
        • Laser Machining – Milling
          • Back: Laser Machining – Milling
          • OPTEC LSV3
          • T-Tech QC5000S-E
        • Dicing – Cutting
          • Back: Dicing – Cutting
          • Disco DAD321
          • Graphtec RoboPro CE5000-40-CRP
        • Printing
          • Back: Printing
          • NanoImprint EHN-3250
        • Miscellaneous
          • Back: Miscellaneous
          • PDMS line
          • Dry Film Laminators
          • Surfx Atomflo 400L
          • Idonus shadow mask aligner
          • Neytech Qex Furnace
          • Furnace ATV PEO-601
          • Furnace ATV SRO-702
      • III/V Lab – IPHYS
    • Process
      • Back: Process
      • Ebeam Lithography
      • Photolithography
        • Back: Photolithography
        • Layout design
        • Mask Fabrication
        • Photoresists available in CMi
          • Back: Photoresists available in CMi
          • AZ 1512 HS
            • Back: AZ 1512 HS
            • AZ 1512 HS Datasheet
          • AZ ECI 3007
            • Back: AZ ECI 3007
            • AZ ECI 3007 Datasheet
          • AZ ECI 3027
            • Back: AZ ECI 3027
            • AZ ECI 3027 Datasheet
          • AZ 10XT-07
            • Back: AZ 10XT-07
            • AZ 10XT-07 Datasheet
          • AZ 10XT-20
            • Back: AZ 10XT-20
            • AZ 10XT-20 Datasheet
          • AZ 10XT-60
            • Back: AZ 10XT-60
            • AZ 10XT-60 Datasheet
          • AZ 40XT
            • Back: AZ 40XT
            • AZ 40-XT Datasheet
          • LOR 5A / AZ 1512 HS
            • Back: LOR 5A / AZ 1512 HS
            • LOR 5A Datasheet
          • AZ NLOF 2020
            • Back: AZ NLOF 2020
            • AZ nLOF 2020 Datasheet
          • AZ 15nXT
          • SU-8
          • M108Y
            • Back: M108Y
            • M108Y Datasheet
          • M35G
            • Back: M35G
            • M35G Datasheet
          • PI 2610 & PI 2611
        • Photolithography Nomenclature
        • HMDS
      • Thin films
        • Back: Thin films
        • Available PVD targets in CMi
        • PVD definitions
      • Materials
        • Back: Materials
        • Silicon Wafers
        • SOI Wafers
        • Glass Wafers
      • Restricted Area (login required)
      • SPC (login required)

In the same section

  • Reservations
  • Organisation
    • About CMi
    • Become a CMi member
    • Access & Security
    • Staff
    • Phone numbers
    • Processing fees
    • Partners & Links
    • Projects
    • Cleanroom photo gallery
    • Picture of the Month
    • News & Events
  • Equipment
  • Process
  • Who we are
  • Associated Campuses
  • Facts
  • Presidency
  • Vice Presidencies
  • Working at EPFL
  • Recruiting EPFL Talents
  • News & Media
  • Sustainability
  • Equality & Diversity
  • Respect
  • Philanthropy
  • EPFL Alumni
  • Bachelor
  • Master
  • Doctorate
  • Continuing Education
  • International
  • Teaching
  • Admission
  • Study Management
  • Educational Initiatives
  • Education & Science Outreach
  • Research Domains
  • Faculty Members
  • Awards & Prizes
  • Collaborate With Our Researchers
  • EPFL Research Facilities
  • Access Our Technologies
  • Research Ethics
  • Research With Animals
  • Meet the Support Units For Research
  • Services to EPFL Laboratories
  • Open Science
  • Innovation Initiatives
  • Industry Collaboration
  • Startup Launchpad
  • Services & Resources
  • Library
  • Restaurants, Shops & Hotels
  • Security, Prevention & Health
  • Sports
  • Community & Support
  • Chaplaincy
  • Events
  • Arts & Culture
  • Associations
  • Visit EPFL
  • Mobility & Travel
  • School of Architecture, Civil & Environmental Engineering ENAC
  • School of Basic Sciences SB
  • School of Engineering STI
  • School of Computer & Communication Sciences IC
  • School of Life Sciences SV
  • College of Management of Technology CDM
  • College of Humanities CDH

Practical

Services & Resources Emergencies: +41 21 693 3000 Contact Map

Follow EPFL on social media

  • Follow us on Facebook
  • Follow us on Instagram
  • Follow us on LinkedIn
  • Follow us on X
  • Follow us on Youtube
Accessibility Disclaimer Privacy policy

© 2023 EPFL, all rights reserved