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  8. AIT CMT-SR2000N 4-Point Probe Measurement System

AIT CMT-SR2000N 4-Point Probe Measurement System

Specifications

Operating Manual

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          • Administration
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            • Tool Description
            • Writing Strategy
            • Conductive Substrate
            • Opaque Reflective Surface
            • Alignment
          • Data Preparation
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            • CATS
            • BEAMER
            • CJOB
            • Batch_job
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            • MMA / PMMA
            • ZEP 520A
            • CSAR 62
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            • Electra 92
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            • Control Computer
            • Holders
            • Alignment Microscope
            • Loading & Unloading
          • Tips
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            • Keep It Simple
            • What NOT To Do
        • Sawatec SM-150 for ebeam resists
        • Sawatec HP-200 hot plates
        • Plade Solvents wet bench
        • Water / Base wet bench
        • Präziterm hot plate
        • Terra universal nitrogen cabinet
      • Photolithography
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        • DUV (λ = 248nm) inline track & stepper
          • Back: DUV (λ = 248nm) inline track & stepper
          • ASML PAS 5500/350C
            • Back: ASML PAS 5500/350C
            • ASML 4x reticle template
            • ASML 4x reticle visual guide
            • ASML 4x reticle design guide
          • TEL Clean Track ACT-8
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          • Süss ACS200 GEN3
          • EVG 150 – AUTOMATIC RESIST PROCESSING CLUSTER
          • RITETRACK 88 SERIES – AUTOMATIC COATER AND DEVELOPER TRACKS
          • Hamatech HMR900
        • Manual coaters
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          • Sawatec SM-200 for photoresists
            • Back: Sawatec SM-200 for photoresists
            • Sawatec SM-200 Manual
          • Sawatec LSM-250 & HP-200
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            • Sawatec LSM-250 & HP-200 Manual
          • Sawatec LSM-200 & HP-401-Z
            • Back: Sawatec LSM-200 & HP-401-Z
            • Sawatec LSM-200 & HP-401-Z Manual
          • Sawatec LSM-250 for MISC polymers
            • Back: Sawatec LSM-250 for MISC polymers
            • Sawatec LSM-250 MISC Manual
        • Exposure tools: laser writers
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          • Heidelberg Instruments VPG200
          • Heidelberg Instruments MLA150 – 1 & 2
            • Back: Heidelberg Instruments MLA150 – 1 & 2
            • MLA150 Manual
            • HIMT “convert” Manual (MLA150)
          • Nanoscribe Photonic Professional GT+
            • Back: Nanoscribe Photonic Professional GT+
            • Nanoscribe PPGT+ Manual
            • Nanoscribe Alignment Manual
            • Describe Manual
        • Exposure tools: mask-aligners
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          • Süss MA6Gen3
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            • MA6 Gen3 Manual
            • MA6 Gen3 Assisted Alignment Manual
            • MA6 Gen3 Film Masks Manual
          • Süss MA6/BA6
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            • MA6 Manual
            • BA6 Manual
          • Süss MJB4
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            • MJB4 Manual
        • Photolithography wet benches
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          • Plade Solvent Z01
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            • Plade Solvent, Lift-off Manual
          • Coillard Solvent Z06
          • Plade Solvent Z06
          • Arias Solvent Z13
          • Arias Base Z13
          • Arias “Lift-off” Z12
        • Additional hot plates / ovens
          • Back: Additional hot plates / ovens
          • YES 310TA, Vacuum cure & HMDS vapor prime oven
          • Accuplate, hotplate for SU-8 PEB and hardbake
            • Back: Accuplate, hotplate for SU-8 PEB and hardbake
            • Accuplate Manual
          • Dataplate, hotplate for SU-8 softbake, PEB or hardbake
            • Back: Dataplate, hotplate for SU-8 softbake, PEB or hardbake
            • Dataplate Manual
          • Heraeus T6060, multipurpose oven
          • Despatch LCD1-16NV-3, biocompatible oven
      • Etching
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        • Ion Beam Etching
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          • Veeco Nexus IBE350
        • Plasma Etching
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          • STS Multiplex ICP
          • Alcatel AMS 200 SE
          • SPTS APS
          • TEL Unity Me
          • SPTS Rapier
          • Oxford – PlasmaPro100 Cobra
        • Resist Strip and Descum
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          • Oxford PRS900
          • Tepla 300
          • Tepla GiGAbatch
          • ESI 3511 Downstream Plasma Asher
          • Jelight UVO Cleaner
        • Gas Etching
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          • SPTS uEtch
          • SPTS Xactix X4 – XeF2 Silicon etching system
        • Grinding / Polishing
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          • STEAG MECAPOL 460 – CMP (CHEMICAL MECHANICAL POLISHING)
          • Alpsitec E460 F – CMP (Chemical Mechanical Polishing)
          • Post CMP Cleaning System GnP Cleaner 428
          • DAG810 – AUTOMATIC SURFACE GRINDER
        • Wet Etching
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          • UFT Piranha
          • UFT Resist
          • Plade Oxide
          • Plade Metal
          • Plade Six Sigma KOH
            • Back: Plade Six Sigma KOH
            • Protek Protective Stop Layer
          • Tousimis Automegasamdri 915B – Critical Point Dryer
          • Arias Acid
      • Thin films
        • Back: Thin films
        • LPCVD / Dry or wet oxidation / Alloying / Doping / Diffusion / Densification / Annealing / ALD
          • Back: LPCVD / Dry or wet oxidation / Alloying / Doping / Diffusion / Densification / Annealing / ALD
          • Centrotherm furnaces
          • Plade RCA
          • ATOMIC LAYER DEPOSITION BENEQ TFS200 (ALD 1)
          • ATOMIC LAYER DEPOSITION BENEQ TFS200 (ALD 2)
          • RTP JETFIRST 200
          • ROVAK Flash Lamp Annealing System Semi-Line 3.0
        • PECVD
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          • Oxford Instruments PlasmaPro 100 ICPCVD
          • Corial D250L PECVD
        • Evaporation
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          • Alliance-Concept EVA 760
            • Back: Alliance-Concept EVA 760
            • User Manual
            • Recipes
            • Steps
            • References
            • Available PVD targets in CMi
            • Precious material billing
          • Leybold Optics LAB 600H
            • Back: Leybold Optics LAB 600H
            • User Manual
            • Recipes
            • Recipe Categories
            • Available PVD targets in CMi
            • Processing fees
          • Vacotec
          • Vacotec VACO 250
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            • User Manual
            • Boats
          • Plassys MEB550SL3 UHV Evaporator
        • Sputtering
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          • Pfeiffer SPIDER 600
            • Back: Pfeiffer SPIDER 600
            • Recipes
            • User Manual
            • Available PVD targets in CMi
            • Precious material billing
          • Alliance-Concept DP 650
            • Back: Alliance-Concept DP 650
            • Recipes
            • Steps
            • Measurement Ref.
            • User Manual
            • Available PVD targets in CMi
            • Precious material billing
        • Pulsed Laser Deposition
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          • Solmates SMP 800
            • Back: Solmates SMP 800
            • Available PVD targets in CMi
        • Electroplating / Parylene coating
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          • Desaules, wet bench for electroplating
          • Silicet Electroplating unit, Cu
          • Comelec C-30-S
      • Metrology
        • Back: Metrology
        • AFM
          • Back: AFM
          • Bruker FastScan AFM
        • FIB / SEM / EDX / ProSEM
          • Back: FIB / SEM / EDX / ProSEM
          • FEI Nova 600 NanoLab
          • Zeiss LEO 1550
          • Zeiss MERLIN
          • EDX
          • Zeiss SEM Crossbeam 550
          • ProSEM software
        • XPS / AES available at MHMC
        • Mechanical profilometers
          • Back: Mechanical profilometers
          • Tencor Alpha-Step 500
          • Bruker Dektak XT
          • KLA Tencor D600
        • Optical measurement
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          • Krüss DSA-30E
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            • Krüss DSA-30E Manual
            • Krüss / ImageJ Surface Tension Manual
            • Krüss Surface Free Energy Models
          • Sopra GES 5E
          • Woollam RC2
          • Bruker Contour X
          • Nanospec AFT-6100
          • FilMetrics F20-UV
          • Filmetrics F54
          • Toho Technology FLX 2320-S
          • Bruker VERTEX70 FT-IR
        • Electrical measurement
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          • Filmetrics R50 – 200 – 4PP
          • AIT CMT-SR2000N 4-Point Probe Measurement System
          • MPI TS150 Probe Station
            • Back: MPI TS150 Probe Station
            • MPI TS150 probe station Manual
        • Optical microscopy
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          • Microscopes at CMi
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            • Leica DM8000
            • Nikon Optiphot 200, inspection microscope
            • Nikon Optiphot 150, inspection microscope
            • Nikon MM 40, inspection and 2-D metrology microscope
            • Mitutoyo, inspection microscope
            • Nikon Eclipse LV150 microscope
      • Packaging – Miscellaneous
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        • Bonding
          • Back: Bonding
          • Süss SB6
            • Back: Süss SB6
            • Süss SB6 Manual
          • TPT HB10
          • F&S Bondtec 56i
        • Laser Machining – Milling
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          • OPTEC LSV3
          • T-Tech QC5000S-E
        • Dicing – Cutting
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          • Disco DAD321
          • Graphtec RoboPro CE5000-40-CRP
        • Printing
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          • NanoImprint EHN-3250
        • Miscellaneous
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          • PDMS line
          • Dry Film Laminators
          • Surfx Atomflo 400L
          • Idonus shadow mask aligner
          • Neytech Qex Furnace
          • Furnace ATV PEO-601
          • Furnace ATV SRO-702
      • III/V Lab – IPHYS
    • Process
      • Back: Process
      • Ebeam Lithography
      • Photolithography
        • Back: Photolithography
        • Layout design
          • Back: Layout design
          • L-Edit installation
        • Mask Fabrication
        • Photoresists available in CMi
          • Back: Photoresists available in CMi
          • AZ 1512 HS
            • Back: AZ 1512 HS
            • AZ 1512 HS Datasheet
          • AZ ECI 3007
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            • AZ ECI 3007 Datasheet
          • AZ ECI 3027
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            • AZ ECI 3027 Datasheet
          • AZ 10XT-07
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            • AZ 10XT-07 Datasheet
          • AZ 10XT-20
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            • AZ 10XT-20 Datasheet
          • AZ 10XT-60
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            • AZ 10XT-60 Datasheet
          • AZ 40XT
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            • AZ 40-XT Datasheet
          • LOR 5A / AZ 1512 HS
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            • LOR 5A Datasheet
          • AZ NLOF 2020
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            • AZ nLOF 2020 Datasheet
          • AZ 15nXT
          • SU-8
          • M108Y
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            • M108Y Datasheet
          • M35G
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            • M35G Datasheet
          • PI 2610 & PI 2611
        • Photolithography Nomenclature
        • HMDS
      • Thin films
        • Back: Thin films
        • Available PVD targets in CMi
        • PVD definitions
      • Materials
        • Back: Materials
        • Silicon Wafers
        • SOI Wafers
        • Glass Wafers
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  • Filmetrics R50 – 200 – 4PP
  • AIT CMT-SR2000N 4-Point Probe Measurement System
  • MPI TS150 Probe Station
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