Sawatec SM-200 for photoresists

To be read first:

  • Cross-contamination: The Sawatec SM-200 coater line is dedicated to the spin-coating of standard CMi photoresists (AZ series from Merck) and LOR polymers. Other polymers should never be used on this coater without staff agreement!
  • Editing recipes is done by the staff only. Please contact the equipment responsibles for special requests.
  • Please immediately inform the CMi staff in case of problems with the equipment.

RESERVATION RULES AND BOOKING FEES POLICY:

  1. No booking restrictions.
  2. 24/7 booking/use is possible with CMi+1 extended access.
  3. Reservation names must correspond to operators.

Contents:

  1. Introduction
  2. Equipement description
  3. Users manuals
  4. Links
  5. Pictures gallery

I. Introduction

The manual coater line in Zone 13 is composed of a ATMsse OPTIhot VB20 HMDS unit, a Sawatec SM-200 coater, a PTZ 28-2 ET Präzitherm hotplate and a high temperature hotplate, to perform all steps of a standard photoresist coating step: surface preparation, spin-coating and softbake.

The three hotplates and the SM-200 coater can accomodate wafers up to 8” or substrates up to 6” x 6” (150 x 150mm), but also small sample/chips.

In CMi, the Sawatec SM-200 manual coater in Zone 13 is dedicated to the coating and bake steps of:

  1. Novolak-based CMi photoresists (AZ series from Merck)
  2. LOR/PGMI products (from Microchem)
  3. Novolak-based i-line photoresists from other suppliers (with staff agreement)

II. Equipment description

Available chucks:

Several chucks are available for the coating of 4″, 6″ and 8″ wafers, as well have smaller samples/chips down to 5mm*5mm. Make sure to select the one with vacuum tracks matching your sample dimensions.

Technical characteristics:

Sawatec SM-200 coater:

  • Manual loading and unloading of the substrates
  • Wafers up to 8” or substrates up to 6” x 6”
  • Special chucks for small chips
  • Substrate fixation via vacuum
  • Motor-Speed: 1 up to 6,000rpm* in 1rpm steps
  • Motor-Acceleration ramp: 1 up to 10,000 rpm/sec* in steps 1rpm/sec (depending on substrate size and load)
  • Spinning time: 1 up to 999 s – Adjustable in 0.1 s steps
  • System with glass cover lid with controlled surface to lid distance
  • >100 recipes and 24 steps per recipe are available

ATMsse VB20 HMDS hotplate:

  • Manual loading and unloading of the substrates
  • Wafers up to 8” or substrates up to 6” x 6”
  • Programmable process parameters: HMDS, nitrogen and vacuum
  • Temperature range: up to 200 °C
  • Hotplate timer: 1 s to 999 s, adjustable in 0.1 s steps
  • >20 recipes and 38 steps per recipe are available

Präzitherm PTZ 28-2 ET hotplate:

  • Manual loading and unloading of the substrates
  • Wafers up to 8” or substrates up to 6” x 6”
  • Maximum tempearture 350 °C, precision +/- 0.5 °C
  • Hotplate surface 280 mm x 200 mm
  • Security sensor preventing overheating

High temperature hotplate:

  • Manual loading and unloading of the substrates
  • Wafers up to 8” or substrates up to 6” x 6”
  • Maximum tempearture 500°C
  • Hotplate surface 150 mm x 150 mm
  • Security sensor preventing overheating

Process:

The documentation for the CMi photoresists process is found here:

III. User manuals

IV. Links

V. Pictures gallery