Page Under Construction
The equipment arrival and its installation are scheduled for June/July 2024. Contact the tool’s responsibles for more information.
I. Introduction
The LTE is an equipment allowing the deposition of metallic layers on 100 mm or 150 mm wafers by evaporation.
The material is evaporated by heating up the crucible in which it is placed by electron beam.
II. Equipment description
Dimensions and capabilities
Throw distance : 1330 mm
The substrate holder is segmented in 6 parts. Each segment can carry 1x 100 mm or 1x 150mm wafer. Adjustable rotation speed between 3 and 33 rpm
Evaporation System
The LTE is equipped with a 10 kW HPE 12 electron gun and has 12 pockets (29 cc), directly cooled.
Pumping
To reach its base pressure, the LTE is equipped with two pumping units :
- Prevacuum Pump Unit EV-S50P : Pump unit consisting of multi stage roots pump and single stage roots-booster pump.
- 300m3/h (5000l/min) (N2)
- Final pressure : 5 x 10-3 mbar
- High Vacuum Pumping System : Cryogenic Pump Unit Coolvac 5000 iCL
Pressure
- 3 Pirani gauges for pre-vacuum
- 1 Penning and 1 Bayard Alpert for high-vacuum