SU-8

Please download the SU-8 runcard to find parameters for all processing steps (Gersteltec GM and Kayaku 3000 series):

Process flow

  Recommended process Alternative process

Substrate Pretreat Oxygen plasma
(Tepla, Z02 or Z11)
Piranha cleaning
(Wet bench, Z02)
Coat Manual coating
(Sawatec LSM200, Z01 or Sawatec LSM250, Z13)
 
Edge Bead Removal (optional) Manual EBR
(Sawatec LSM200, Z01 or Sawatec LSM250, Z13)
 
Relaxation + Soft Bake Hotplate soft baking
(Sawatec HP401Z, Z01
or Sawatec HP200, Z13)
Hotplate with exhaust
(Dataplate, Z01)
Expose

i-line exposure (MJB4, Z13 or MA6 Gen3, Z01)

Direct laser writing (MLA150, Z16 or VPG200, Z05 !thickness < 50um only!)

Broadband exposure
(MA6, Z06)

Post Exposure Bake (PEB) Hotplate baking
(Sawatec HP401Z Z01 or Accuplate, Z01 or Sawatec HP200, Z13)
Hotplate with exhaust
(Dataplate, Z01)
Develop Manual development in PGMEA
(Plade Solvent, Z01 or Solvent Bench, Z13)
 
Rinse & Dry Rinse with isopropanol, dry with nitrogen gun Isopropanol + spin rinse dry
(Semitool SRD, Z01)
Hard Bake (optional) Hotplate curing
(Accuplate, Z01)
Hotplate or oven curing
(Dataplate, Z01 or Heraeus oven, Z2)
Observation Microscopes