Please download the SU-8 runcard to find parameters for all processing steps (Gersteltec GM and Kayaku 3000 series):
Process flow
| Recommended process | Alternative process |
|
| Substrate Pretreat | Oxygen plasma (Tepla, Z02 or Z11) |
Piranha cleaning (Wet bench, Z02) |
| Coat | Manual coating (Sawatec LSM200, Z01 or Sawatec LSM250, Z13) |
|
| Edge Bead Removal (optional) | Manual EBR (Sawatec LSM200, Z01 or Sawatec LSM250, Z13) |
|
| Relaxation + Soft Bake | Hotplate soft baking (Sawatec HP401Z, Z01 or Sawatec HP200, Z13) |
Hotplate with exhaust (Dataplate, Z01) |
| Expose |
i-line exposure (MJB4, Z13 or MA6 Gen3, Z01) Direct laser writing (MLA150, Z16 or VPG200, Z05 !thickness < 50um only!) |
Broadband exposure |
| Post Exposure Bake (PEB) | Hotplate baking (Sawatec HP401Z Z01 or Accuplate, Z01 or Sawatec HP200, Z13) |
Hotplate with exhaust (Dataplate, Z01) |
| Develop | Manual development in PGMEA (Plade Solvent, Z01 or Solvent Bench, Z13) |
|
| Rinse & Dry | Rinse with isopropanol, dry with nitrogen gun | Isopropanol + spin rinse dry (Semitool SRD, Z01) |
| Hard Bake (optional) | Hotplate curing (Accuplate, Z01) |
Hotplate or oven curing (Dataplate, Z01 or Heraeus oven, Z2) |
| Observation | Microscopes |
