Mask fabrication is an established standard process available in the CMi CM-1 cleanroom. The process flow below describes process parameters, steps of operation and equipment used. The current process uses the Heidelberg Instruments VPG200 laser writer and the Hamatech HMR900 Mask Processor.
Step information / Cross section | Equipment | Recipe / Parameters |
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Starting material:
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cmi.epfl.ch |
Commercial plates (Nanofilm) are available in standard sizes (5×5 inch for exposure on 100mm wafers, 7×7 inch for exposure on 150mm wafers, 4×4 inch for exposure on small wafers & piece parts). 6×6 inch plates for stepper reticles are available but please discuss with the CMi staff before placing an order.
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Laser writing:
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Z5 – VPG200 |
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Development (diluted AZ 351B) & Rinse:
Cr etch & Rinse:
Resist strip (AZ 400K) & Rinse: |
Z6 – Hamatech Mask Processor |
Equipment preparation (purge):
Mask processing:
Mask cleaning:
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Inspection |
Z6 – Leica Microscope |
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Final use |
Note that the image of the written data is mirrored over the Y axis. |