PI 2610 & PI 2611

Please download the polyimide runcard to find parameters for all processing steps (HD Microsystems PI series):

Process flow

  Recommended process Alternative process

Unfreeze Resist

Take the PI bottle out of the freezer at least 1 hour before use.

The PI polymer deteriorates at each thermal cycle (warm-up & freeze). Put a mark on the dose after each use, do not use a dose for more than 5 work sessions.

Substrate Pretreat

Oxygen plasma
(Tepla, Z01 or Z11)

Thermal dehydration – (Süss Hotplates, Z06)

Piranha cleaning
(Wet bench, Z02)

VM652 Silanization (optional)
Manual coating
(Sawatec LSM200, Z06)
PI Coating Manual coating
(Sawatec LSM200, Z06)
Soft Bake Option 1 (fast): 65° 3 minutes + 105° 3 minutes
(Süss Hotplates, Z06)
Option 2 (low stress): slow ramp to 120°C
(Sawatec HP401Z, Z11)
Curing Oven curing
(Heraeus T6060, Z11)