Ebeam lithography

Electron beam lithography system

Equipment
– 100 keV Thermal Field Emission Gun
– Gaussian Beam > 1 nm minimum pixel size
– > 20 nm mean + 3σ overlay accuracy
– 50 MHz Pattern Generator
– 50, 100, 150 mm wafers and piece parts
– Housed in a custom cleanroom 21 °C ± 0.1 °C
– Location: Zone 7
Documentation
Manual
Responsibles
Z. Benes
J. Pernollet

Manual coater and Develop wet benches

Equipment
– Programmable coater for ebeam resists
– 50, 100, 150 mm wafers and piece parts
– Manual dispense
– Location: Zone 7
Documentation
Manual
Responsibles
Z. Benes
J. Pernollet
Equipment
– Wet bench for development of ebeam resists
– Ultrasonic bath
– Location: Zone 7
Documentation
Manual
Responsibles
Z. Benes
J. Pernollet
Equipment
– Wet bench for development of ebeam resists
– Location: Zone 7
Documentation
Safety
Manual
Responsibles
Z. Benes
J. Pernollet

Hot plates and Dryer

Equipment
– Hotplate for dehydration and soft bake of ebeam resists
– Maximal temperature: 200 °C
– Location: Zone 7
Documentation
Manual
Responsibles
Z. Benes
J. Pernollet
Equipment
– Hotplate for dehydration and soft bake of ebeam resists
– Maximal temperature: 200 °C
– Location: Zone 7
Documentation
Manual
Responsibles
Z. Benes
J. Pernollet
Equipment
– Nitrogen atmosphere cabinet to keep labware dry
– Location: Zone 7
Documentation
Manual
Responsibles
Z. Benes
J. Pernollet