Laser Welding CTI Project
This common project between EPFL, Hesso Valais and Heraeus Materials SA intends to improve the design and the production of very small medical devices, mainly used in brain vessel procedures. This development will support the development of new surgical mini-invasive procedures linked to new implants and instruments.
The primary goal of this project is to support development of such devices related to brain vessel diseases, by mastering the weld ability of very thin wires, and to guarantee the mechanical stability of heterogeneous welding to use them in very thin medical devices. Processes will be developed to allow the complete control of these issues, in order to keep serving this market shares by creating disruptive technologies.