The FIB is able to mill almost any material. Thus it is powerful tool for TEM lamella preparation. Moreover precision of the lamella position is high thanks to FIB imaging ability.
In the image above, a specific TEM lamella preparation (lift-out in situ) is shown. The region of interest is first covered by a protecting material (carbon or platinum). Holes are milled on each side of the lamella. This last one is lifted-out by a micromanipulator and glued on a support where the final thinning takes place.