Resonant RF networks are promising devices for many applications. In 2009, a first collaboration between SPC/Tetra Pak/Helyssen and sponsored by the Commision for Technology and Innovetion (CTI) was established. To this day, it is one of the major projects of the group: “Basic Plasma Physics and Applications”.
In order to have a better productivity, recurrent needs of food packaging are to increase process rates and source areas. In this context, large resonant RF network have been proposed as a solution. The real impedance at the resonance frequency is a great advantage as it simplifies the power matching and minimizes the high input currents inherent to up-scaling of conventional capacitively or inductively coupled devices. Beside this point, the plasma discharge produced by RF networks is comparable to conventional inductively coupled plasma devices, with high power transfer efficiencies.
These properties have been demonstrated in antennas 70 x 40 cm2 large. The construction of a new antenna 1.2 x 1.2 m2 has been completed and tested in 2015.