Research LineThermal, power and performance aware design of 2D/3D system-on-chip (SOC) architectures
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3D-ICE stands for 3D Interlayer Cooling Emulator. It is a Linux based Thermal Emulator Library written in C, which can perform transient thermal analyses of vertically stacked 3D integrated circuits with inter-tier Microchannel Liquid Cooling. It is based on Compact Transient Thermal Modeling (CTTM) of solids and liquids.
Also, check out our new FAQ page.
Usage of 3D-ICE
3D-ICE is the result of a committment to build a thermal simulator that is uncomplicated, easy to use, simple to understand, and compact and light enough to run fast on computers using minimal resources. The primary intended users of 3D-ICE are VLSI designers, heat sink engineers, and researchers and students developing the next generation cooling solutions for ICs. 3D-ICE accepts the physical description of the 3D-IC stack in the form of a simple and straightforward netlist file called the “Stack Description File”. The thermal power distribution of the individual dies can be given to 3D-ICE using “Floorplan File”. Using this information, 3D-ICE performs the transient thermal analysis of the system. There are a myriad of functions available that enable the user to print a variety of thermal data such as thermal maps of individual dies, temperature evolution at a single floorplan element against time etc.
3D-ICE Project Team
PS: We are constantly looking out for your feedback and comments in our stive to improve 3D-ICE. Please read this page to find out how you can contact us.
IMPORTANT INFORMATION BEFORE YOU INSTALL:
Please ensure that you have the correct versions of bison and flex before you install 3D-ICE. Specifically,
Please see the User Guide for more information before installation.