Biodegradable and Bioresorbable Electronics and Microsystems

The scope of this research is to develop eco-friendly transient microsystems that can naturally disappear either in the environment (biodegradable), or when implanted in the human body (bioresorbable) We are researching the integration of eco-friendly functional materials using scalable and flexible solution processing techniques such as additive and digital manufacturing.

Developing these systems is particularly challenging due to chemical and temperature compatibility issues with the different functional and structural materials. We are working towards developing techniques  overcoming material incompatibilities, working towards fabricating fully degradable printed electronics. We have realized among others printed humidity and temperature sensors and transistors on biodegradable substrates. We are also investigating the biodegradation  properties of the components and their integration into systems for given applications.

Our current work includes:

  • Development of additive manufacturing processes functional biodegradable materials, conductors, dielectric and semiconductors, on soft substrates
  • Development of low-temperature curing and sintering processes such as photonic and deep-UV curing
  • Fabrication of devices for novel green or biomedical applications, in such fields as smart food packaging, environmental and health sensing, IoT, wearables, and implantable systems


  Sensors and transistors printed on biodegradable substrates

Contact person

Dr. Danick Briand


Swiss National Science Foundation (SNF)

Mattana, G., Briand, D., Marette, A., Quintero, A. V., & de Rooij, N. F. (2015). Polylactic acid as a biodegradable material for all-solution-processed organic electronic devices. Organic Electronics, 17, 77-86.
Vásquez Quintero, A., Frolet, N., Marki, D., Marette, A., Mattana, G., Briand, D., & De Rooij, N. F. (2014, January). Printing and encapsulation of electrical conductors on polylactic acid for sensing applications. In Micro Electro Mechanical Systems, 2014 IEEE 27th International Conference, 532-535.