SU-8 photoresist is based on an epoxy resist developed by IBM. SU-8 is a thick (single coating up to 300um), near-UV photoresist (i-line), specifically used for applications requiring high aspect ratios with vertical sidewall profiles. SU-8, after exposure and cross-linking, is resistant to wet chemistry (solvent or base) and cannot be stripped.
CMi currently supplies series 3000 from Kayaku, and series GM10XX from Gersteltec, but other SU-8 grades can be processed on the same equipment.
PermiNex® is an epoxy based, photo-imageable bonding resist used as an adhesive layer for the definition and capping of cavity structures such as BAW, SAW, microfluidic devices, and others, where critical alignment, low temperature processing and high bond quality are desired.
CMi currently supplies series 1005 and 2005 from Kayaku, but other Perminex grades can be processed on the same equipment.
Polyimide (Kapton) are rigid polymers with desirable film properties such as low stress, low thermal expansion (CTE matching silicon) , low moisture uptake, good ductility. It is ideally suited as a dielectric layer for most semiconductor applications requiring thick films or stacked layers of metallisation. Patterning is typically done by dry etch or laser ablation techniques.
CMi supplies non-photosensitive grades PI 2610 and PI 2611, but other polyimide grades can be processed on the same equipment.
Cyclotene is an advanced electronic polymer, derived from B-staged bisbenzocyclobutene (BCB) monomers, developed for use as spin-on dielectric materials in microelectronic device fabrication. It has a low dielectric constant, high breakdown voltage, and feature low moisture absorption, no out-gassing, low temperature cure and excellent planarization.
CMI provides two cyclotene grades to its users: the 3022-35 dry-etchable grade, and the 4022-35 photo-patternable grade. Other cyclotene grades can be processed on the same equipment.
Parylene is the common name of a polymer whose backbone consists of para-benzenediyl rings (C 6H4) connected by 1,2-ethanediyl bridges (CH2−CH2). Several variants (C, N, D, AF-4, …) exist where hydrogen atoms are replaced with functional groups.
Parylene coatings are conformal and pinhole-free since they are applied by chemical vapor deposition (CVD). Parylene is considered a “green” polymer because its polymerization needs no initiator or other chemicals to terminate the chain; and the coatings can be applied at or near room temperature, without any solvent.
CMi provides coating service for the parylene C variant (other variants on request). It can be used for electrical insulation, moisture barriers, or protection against corrosion and chemical attack (resistance to HF, KOH and solvents).
Polydimethylsiloxane (PDMS), is a silicone polymer with chemical formula CH3[Si(CH3)2O]nSi(CH3)3. It features a unique set of properties that makes it attractive for many micro-fabrication projects.
First, it is a sticky and viscoelastic polymer, which can be stretched and deformed heavily, while recovering its initial shape over time. As such it finds applications as a stamp for soft-lithography, and as a platform for flexible electronic devices.
In addition, It is optically clear, inert, and bio-compatible and, as such, is a great candidate to use for microfluidic chips.
WaferBOND® HT-10.11 material is an organic coating developed as a temporary wafer bonding solution for MEMS and 3-D wafer-level packaging applications. WaferBOND® HT-10.11 material enables effective bonding and support through substrate thinning and backside standard lithographic. After processing, samples are released through chemical immersion. WaferBOND has been specifically developed for thin wafer handling (TWH), through-silicon via (TSV) reveal, and redistribution layer (RDL) creation processes up to 250°C.
The ORDYL dry film is a negative tone i-line photoresists, rolled over the substrate by hot laminators, and offering high resistance to plating baths and acid etching processes. After exposure it is developed and stripped in alkaline solutions. Although it does not reach the printing resolution of spin-coated photoresists, it offer an interesting alternative for substrate with extremely high topography. CMi offers access to ORDYL 920 and 940 grades from ELGA Europe but photo-patternable dry films (such as SU-8, polyimide, BCB) from other companies can also be used in CMi.
