Etching Tool Selector

Available etching equipment is split in three categories: 

Classification of the materials is as follow:

  • E : etched as target material.
  • A1 : authorized in the tool. Can be exposed and may be etched (process dependent).
  • A2 : authorized upon staff agreement. Can be loaded in the tool but MUST be fully covered protected by an A1-material.
  • B : banned for the tool. Cannot be present on sample, even if traces only or if well covered protected under an A1 material.

Plasma & gas dry patterning

MaterialNexusRapierAMSSynapseDRMAPSMultiplexCobraRIE1RIE2uEtchXactix
AgEA2A2BBA2A2A2BBA1A1
AlEA1A1BBA1EEA2BA1A1
AlCuEA2A2BBA2A2BBBBA1
Al2O3EA1A1BBA1EEA2BA1A1
AlNEA1A1BBA1EEBBA1A1
AlScNEA1A1BBA1EA2BBA1A1
AuEA2A2BBA2A2A2BBA1A1
BARCEEEEEEEEA1A1BA1
BCBEA1A1BBEA1A1BBBA1
BorofloatEA1A1BBEA2A2BBBA1
BTOEA1A1BBA1A1A1BBBA1
CoEA2A2BBA2A2A2BBA1A1
CrEA2A2BBA1A2A2BBA1A1
CuEA2A2BBA2A2BBBBA1
DiamondEA1A1BBEEEBBA1A1
DLCEA1A1A1BEEEBBA1A1
FeEA2A2BBA2A2A2BBBA1
GaAsEA2A2BBA2EA2BBBA1
GaNEA1A1BBA1EA2BBBA1
GeEEEBBEEEEBBE
GeSnEA2A2BBA2A2A2BBBA1
GrapheneEEEBBEEEEA1BA1
GraphiteEEEBBEEEEA1BA1
hBNEA1A1BBA1EEEBA1E
HfO2EA1A1BBA1EEA2BA1A1
InAsEA2A2BBA2A2A2BBA1A1
IrEA2A2BBA2A1BBBA1A1
ITOEA1A1BBA1A2A2BBBA1
LiNbO3EA1A1BBEEBBBA1A1
LiTaO3EA1A1BBEEBBBBA1
MoEA1A1BBA1EEBBA1E
MoS2EA1A1BBA1EEBBA1A1
NbEA1A1BBEEEBEA1A1
NbNEA1A1BBEEEBEA1A1
NbTiNEA1A1BBEEEBEBA1
NiEA1A1BBA1A1A1BBA1A1
ParyleneEEEEBEEEBBA1A1
PdEA1A1BBA1EA1A2BA1A1
PDMSEA1A1BBEA2A2BBBA1
PolyimideEEEEBEEEA1BBA1
PtEA1A1BBA1EA1A2BA1A1
PyrexEA1A1BBEA2A2BBBA1
PZTEA2A2BBA2A2BBBBA1
ResistA1A1A1A1A1A1A1A1A1A1BA1
SapphireEA1A1BBA1EEBBA1A1
SiEEEA1A1A1EEA1A1A1E
SiCEA1A1A1A1EEEBBA1A1
SiGeEEEBBEA1A1EBBE
SiNEEEEEEEEA1A1BA1
SiO2EEEEEEEEA1A1EA1
SU8A1A2A2BBA2BBBBA1A1
TaEA1A1BBA1EEBEBA1
TaNEA1A1BBA1EEBEBA1
TiEA1A1BBA1EEA2EBA1
TiNEA1A1BBA1EEBEBA1
TiO2EA1A1BBA1EEBEBA1
VO2EA1A1BBA1EEBBBA1
WEA1A1BBA1EEBBA1A1
ZnOEA2A2BBA2A2A2BBBA1
ZrO2EA1A1BBA1EEBBA1A1

Wet chemical etching

Coming soon…

Dry & wet cleaning

Coming soon…