***Master Project***
Contacts: Dr. MER Sandro Carrara, Senior Scientist, EPFL-IC-ISIM-LSI
Ms. Ioulia Tzouvadaki, PhD Student, EPFL-IC-ISIM-LSI
Description:
Memristive Biosensors based on two-terminal silicon nanowire devices are emerging as promising building blocks for miniaturized bioassays achieving label-free detection of biomolecules, such as cancer markers. The sensing method is based on the hysteresis modification appearing in the memristive electrical response of the nanodevice before and after surface biological treatment.
In medical applications reducing time in diagnostic procedures might be crucial. Thus, the biosensor platform should provide a quick and accurate response signal. Chip encapsulation leads to a quicker acquisition of the electrical readout while increasing the reliability and reproducibility of the outcome signal. Furthermore, it importantly contributes in the prevention of the substrate physical damage and corrosion, ensuring the stability of the sensing output. Moreover, the encapsulation platform enables compatibility of the nanofabricated biosensors with different experimental and measuring platforms enhancing scientific research collaborations and opening the way for the biosensor’s commercialization. Finally, an optimized encapsulation configuration shows great potential when incorporating the Memristive Biosensors with microfluidic and electronic platforms for LoC (lab-on-a-chip) and PoC (point-of-care) applications with appropriate integration and multiplexing aspects.
The goal of this project is the development of an electronic biomolecular sensor system based on nanofabricated Memristive Biosensor configurations and composed of fully encapsulated, micro-sized silicon chips.
Tasks:
- Design (Layout) and Fabrication (Clean Room fabrication) of electrical connections to be integrated with nanowire devices;
- Capsule platform design for chip integration and wire bonding;
- Design and realization of 3D-printed box for enabling measuring process;
- Integration and testing of the final platform.
Eligibility Requirements:
- Course-level knowledge in lithographic processes
- Electronic packaging and wire bonding
- Basic knowledge of circuit design and readout electronics
- Course-level knowledge in nanotechnology
- Interest and motivation
Tasks:
- Design (Layout) and Fabrication (Clean Room fabrication) of electrical connections to be integrated with nanowire devices
- Capsule platform design for chip integration and wire bonding
- Design and realization of 3D-printed box for enabling measuring process
- Integration and testing of the final platform
Eligibility Requirements:
- Course-level knowledge in lithographic processes
- Electronic packaging and wire bonding
- Basic knowledge of circuit design and readout electronics
- Course-level knowledge in nanotechnology
- Interest and motivation