INTERNSHIP, SEMESTER AND MASTER PROJECTS
High-Density Electrode Arrays by Hybrid Integration
Master Thesis
This project aims to advance neural interface technology by exploring the hybrid integration of a commercial high-channel recording chip (the Nixel 512 chip from Science Corporation) with the soft, flexible implantable arrays developed at the Laboratory for Soft Bioelectronic Interfaces (LSBI). Utilizing flip-chip bonding, we will integrate a high-performance silicon recording chip with our soft electrode arrays, offering an avenue to increase the density and channel count of our devices.
The project will focus on the fabrication and characterization of implantable electrocorticography (ECoG) arrays incorporating the Nixel chips.
Project Goals:
- Design:
- Design of the layout of the high-density electrode arrays.
- Cleanroom Microfabrication:
- Develop a two-layer metallization process to facilitate the routing in our flexible neural interfaces.
- Fabricate the high-density electrode arrays.
- Optimize the flip-chip bonding of bare dies onto thin-film polymeric substrates, adapted to the selected chip.
- Characterization:
- Characterize electrically and electrochemically the performance of fabricated devices.
- Assess the reliability of the flip-chip bonding process with the selected chip.
Must-have Competencies:
- Strong motivation and interest in the development of novel neural interfaces for biomedical applications.
- Theoretical knowledge of standard microfabrication and photolithography processes.
- Strong understanding of electrophysiology and the basics of bioelectronic interfaces.
- Good problem-solving skills and an ability to work independently within an interdisciplinary team environment.
Nice-to-have Competencies:
- Experience working in a cleanroom environment.
- Experience in bench testing of neural interfaces.
To apply (or for more information): Horacio Londoño Ramírez
Development of Flexible Field Effect Transistor (FET)-Based Sensors for Neural Biosensing Applications
Semester project
This project focuses on the development of flexible Field Effect Transistor (FET)-based sensors designed for biosensing neural signals, including neurotransmitters and other biomarkers such as metabolites or proteins relevant to neural activity. The goal is to enhance neural signal recordings with biochemical insights, offering a better understanding of the neural microenvironment and advancing neuroprosthetics, diagnostics, and bioelectronic medicine.
Project Goals:
- Design and Fabrication:
- Develop flexible FET-based sensors with high sensitivity for neural biomarkers.
- Optimize the fabrication process for reproducibility.
- Surface Functionalization:
- Test the stability and selectivity of functionalized sensors under different conditions.
- Electrical and Biochemical Characterization:
- Evaluate sensor performance parameters such as sensitivity, limit of detection, and response time.
- Application in Neural Biosensing:
- Demonstrate the potential of these sensors to complement neural signal recordings by detecting key neurotransmitters (e.g., dopamine, glutamate) or other biomarkers associated with neural activity.
Must-Have skills:
- Motivation and interest in applying biosensors in neuroscience and other biomedical applications.
- Basic understanding of Field Effect Transistor (FET) principles and biosensor mechanisms.
- Familiarity with neurophysiology, including biomarkers and their significance in neural processes.
- Team-oriented and collaborative mindset.
Nice-to-Have skills:
- Experience with microfabrication techniques and cleanroom processes.
- Knowledge of bioreceptor immobilization strategies (e.g., covalent bonding, adsorption).
- Familiarity with sensor testing in different media (e.g., buffers, biological fluids).
- Understanding of materials science, especially in the context of flexible and biocompatible substrates.
- Knowledge of CAD software and 3D printing for sensor integration and packaging.
References:
Zhao, C., Cheung, K. M., Huang, I.-W., Yang, H., Nakatsuka, N., Liu, W., Cao, Y., Man, T., Weiss, P. S., Monbouquette, H. G., & Andrews, A. M. (2021). Implantable aptamer–field-effect transistor neuroprobes for in vivo neurotransmitter monitoring. Science Advances, 7(48), eabj7422. https://doi.org/10.1126/sciadv.abj7422
To apply, please contact: Desirée Maulá
Electrically-Induced Insulin Secretion from Pancreatic β-Cells: Development of Next-Generation Bioelectronic Platforms
Semester project
Explore bioelectronic systems that modulate insulin secretion from pancreatic β-cells through electrical stimulation. You will improve the design, reliability, and reproducibility of a platform that already showed promising preliminary results.
Project Goals
- Design electrode arrays compatible with standard multi-well plates.
- Optimize geometry and materials for better biocompatibility.
- Integrate electrodes with plastic culture wells and achieve robust packaging.
- Perform cell viability and stimulation tests with Ins-1 E-luc cells.
- Tune stimulation protocols and quantify insulin via luminescence.
- Optional: implement multi-zone stimulation or ELISA quantification.
Must-Have skills
- Interest in bioelectronics and biomedical engineering.
- Basic knowledge of cleanroom and microfabrication processes.
- Ability to work independently and troubleshoot in a lab environment.
Nice-to-Have skills
- Experience with AutoCAD or similar tools.
- Familiarity with biological cell culture or stimulation.
- Basic electrical/electrophysiology experience.
References
Liebman et al. – 2021 – Altered β-Cell Calcium Dynamics via Electric Field
To apply, please contact Pietro Palopoli
Designing the Future of Wireless Neural Interfaces: Microfabrication of Coils and Antennas for Soft Bioelectronics
Semester project or Master Thesis
Design and fabricate ultra-flexible thin-film coils and antennas for wireless power and Bluetooth communication in neural implants. Build on previous work to optimize integration and performance.
Project Goals
- Refine flexible coil and antenna design for 13.56 MHz and 2.4 GHz.
- Fabricate polyimide-based devices with precise copper patterning.
- Optimize via-hole processes and encapsulation.
- Characterize RF and mechanical performance.
- Optional: integrate coils with Bluetooth modules and test boards.
Must-Have skills
- Motivation for neurotech, wireless systems, and microfabrication.
- Basic understanding of RF/electrical principles.
- Familiarity with photolithography and cleanroom work.
Nice-to-Have skills
- Experience with antennas or PCB design.
- Use of tools like HFSS, Sim4Life, COMSOL.
- Firmware or embedded programming skills.
References
Gao et al. – 2023 – Characterization of a Miniature Broadband Antenna
To apply, please contact Pietro Palopoli
Electrodeposition of Antennas, Coils, and Microbumps for Wireless Neurotechnologies
Summer semester project
Develop and optimize electrochemical methods to fabricate antennas, coils, and microbumps for next-gen wireless, flexible bioelectronic systems.
Project Goals
- Tune copper/gold electrodeposition parameters for devices.
- Fabricate structures using cleanroom processes.
- Characterize electrical/RF performance and metal morphology.
- Test bump bonding reliability under different methods.
Must-Have skills
- Interest in electrochemistry and wireless electronics.
- Basic knowledge of materials science or EE.
- Self-driven approach and experimental problem-solving.
Nice-to-Have skills
- Cleanroom experience (spin-coating, profilometry, etc.).
- Familiarity with VNAs or electrodeposition setups.
- Data analysis in MATLAB/Python.
References
Schurch et al. 2023 – Direct 3D microprinting of highly conductive gold structures via localized electrodeposition
To apply, please contact Pietro Palopoli
Microbump-Based Electrical Interconnects for High-Density Neural Interfaces
Semester project or Master Thesis
Develop and test microbump-based flip-chip bonding methods to connect dense microchips to soft neural interfaces. Ensure low-impedance, reliable, and scalable connections.
Project Goals
- Fabricate microbumps via electrodeposition.
- Compare bump geometries and bonding materials.
- Test bonding strategies (reflow, ultrasonic, etc.).
- Characterize electrical/mechanical performance.
- Analyze scalability to >1000-channel implants.
Must-Have skills
- Interest in packaging, neuroengineering, or microsystems.
- Cleanroom experience and electrical testing familiarity.
- Attention to detail and iterative experimental mindset.
Nice-to-Have skills
- Experience with bonding techniques and tools (SEM, profilometer).
- Background in microelectrode or signal integrity testing.
References
Lau et al. 2016 – Recent Advances and New Trends in Flip Chip Technology
To apply, please contact Pietro Palopoli
REQUIREMENTS
Students applying for internships must either be awarded credits for their work (e.g. master thesis) or provide their own funding (e.g. non-credited summer internship).
Registered EPFL bachelor and master students
You should organise your agenda to be on site, in Geneva, for at least a full day per week. The travel costs between EPFL Lausanne and EPFL Geneva will be covered.
External students from a partner University
The list of partner universities can be found here. To join the LSBI, you should register first through EPFL academic services – please check the following website for additional information.
External students from a non-partner University
You are welcome to apply to join the LSBI, but you will need to find your own funding source e.g. a scholarship, a grant, etc.
Fellowships
Foreign students are welcome to apply to one of the following schemes to join the LSBI for a summer, a semester or a year-long internship.
EPFL Excellence in Engineering, E3 program for Summer internship