Packaging – Miscellaneous

Bonding

Equipment
– 100mm wafer size bonding
– 3 mbar vacuum
– N2 Purge
– Voltage max 1000V
– Max Temperature 450 °C.
– Motorized z-axis, pneumatic and simultaneous spacers and clamps movements
– Location: Zone 6
Documentation
Equipment Description
User Manual
Responsibles
G.-A. Racine
J. Dorsaz
Equipment
– Aluminum 17.5um and 33um wedge-wedge bonding
– Gold 20um and 25um wedge-wedge and ball-wedge bondings
– Epoxy die attach
– Glob-top protection
– Location: Zone 17
Documentation
Manual
Data sheet
Guidelines
H20E-FC electrically conductive epoxy
H70E electrically insulating epoxy
H70E-2 thermally conductive glob-top
Responsibles
A. Toros

Laser Machining – Milling

Equipment
– 193nm ArF, up to 10J/cm2
– Mainly polymers (PMMA, PC, Polyimide, PET…)
– Samples of various shapes and sizes
– Built-in solutions for matrix processes, grooves creator
– Jobs recipes handling
– DXF converter
– Location: Zone 18/19
Documentation
Manual
Datasheet
Startup/shut-off routines
Dose calibration
Gas renewal
CAD masks data file
Responsibles
J. Pernollet
Equipment
– Quick circuit prototyping
– Min trace: 130um
– Min hole: 330um
– Spindle speed: 8’000 to 24’000rpm
– Positioning resolution: 6.5um
– Location: Zone 10
Documentation
Manual
Responsibles

Dicing – Cutting

Equipment
– 100, 150 mm wafers
– Silicon, glass and pyrex wafers
– Other materials on demand
– Maximum thickness 1 mm on silicon and 2.4 mm on glass and pyrex
– Location: Zone 9
Documentation
Manual
Dicing request
Responsibles
A. Toros
Equipment
– High-speed cutting (up to 60 cm/s)
– Down to 500 µm precision
– Media thickness up to 250 µm
– Location: Zone 16
Documentation
Manual
Responsibles
J. Pernollet

Printing

Equipment
– Vertically air-pressurized cylinder
– Temperature up to 200 °C
– Imprinting intensity up to 3 kN
– Imprinting area up to 150×150 mm
– Location: Zone 11
Documentation
Manual
Responsibles
J. Pernollet
Equipment
– 4-inch mold/die compatible
– 90N to 400N imprinting intensity
– LED UV source: 375nm, 2.5mW/cm2
– Continuous or pulsed irradiation (0.1s duty)
– Location: Zone 13
Documentation
Manual
Responsibles
J. Pernollet

Miscellaneous

Equipment
– Automatic mixing machine
– Spin coating (100 mm wafers, microscope slides, 10×10 mm samples)
– Molds anti-sticking treatment
– Oxygen plasma surface activation
– Hole puncher on video camera
– Location: Zone 12
Documentation
Manual
Responsibles
J. Pernollet
C. Hibert
Equipment
– Hot rolls laminators
– Accurately controlled heat, pressure, speed
– Quick and easy wafer processing
– ALPHA940 and ALPHA920 dry films
– Location: back of Zone 1
Documentation
Manual
Responsibles
J. Pernollet
Equipment

Location: Zone 3
Documentation
Manual
Brochure
Responsibles
G.-A. Racine
Equipment

Location: Zone 16
Documentation
Manual
Brochure
Responsible
J. Pernollet
Equipment
– Mono-sample loading, max 100mm
– Up to 1200°C
– Vacuum and Nitrogen environment
– Location: Zone 11
Documentation
Manual
Brochure
Responsibles
C. Hibert