Metrology

AFM

Equipement
– 150mm X 180mm inspectable area with rotating chuck
– Automated laser and detector alignment
– <30pm vertical noise with closed-loop Icon scanner
– High speed imaging with FastScan scanner
– Location: Zone 15
Documentation
Manual
Responsibles
D. Bouvet
R. Juttin

FIB / SEM / EDX / ProSEM

Equipement
– 100, 150 mm wafers and piece parts
– High resolution SEM imaging
– Ion beam patterning (> 100nm)
– Up to 30 kV SEM and FIB acceleration voltages
– Cross-sections, TEM lamellas, Omniprobe manipulator
– Location: Zone 8
Documentation
Manual
Responsibles
Z. Benes
J. Pernollet
Equipement
– 100, 150 mm wafers, cleaved samples and piece parts
– High resolution SEM imaging (~5nm)
– From 0.5 to 10 kV acceleration voltage
– Location: Zone 1
Documentation
Manual
Responsibles
Z. Benes
J. Pernollet
Equipement
– 100 wafers, cleaved samples and piece parts
– High resolution SEM imaging (<1nm)
– From 0.02 to 30 kV acceleration voltage
– SE, In-Lens and Energy Selective Backscatter detectors
– EDX Analysis
– Location: Zone 15
Documentation
Manual
Responsibles
Z. Benes
J. Pernollet
Equipement
– Energy Dispersive X-ray Spectroscopy
– Oxford Instruments X-MAX silicon drift type detector 50mm2
– Resolution 127eV FWHM
– Detection limit about 1 atomic %
– AZtec and INCA software
– Location: Zone 15
Documentation
Manual
Responsibles
Z. Benes
J. Pernollet
Equipement
– GenISysSEM image analysis software
– CD and line-edge roughness measurements
– Automatic pattern edge detection
– Multiple features in a single image analysis
– Batch processing of multiple images
– Location: BM1132
Documentation
Manual
Responsibles
Z. Benes
J. Pernollet

XPS / AES available at MHMC

Please visit “Surface characterization” MHMC page for more details.

Please visit “Surface characterization” MHMC page for more details.

Mechanical profilometers

Equipement
– Measurement range in Z : 10 nm to 300 µm
– Spacial resolution : 10 µm
– Location: Zone 15
Documentation
Manual
Responsibles
G. Clerc
Equipement
– Measurement range in Z : up to 1mm
– Step height repeatability: 5A
– 3D stress and 3D mapping
– Location: Zone 4
Documentation
Manual
Tutorial for database
Responsibles
D. Bouvet
G. Clerc
Equipement
Measurement range in Z : up to 1mm

Step height repeatability: 20A

– Measurement range in Z : up to 1mm
– Step height repeatability: 20A
– Location: Zone 19
Documentation
Manual
Responsibles
D. Bouvet

Optical measurement

Equipement
– Contact Angle and Surface Free Energy (SFE) measurements
– Multi-dosing system (4 automatic and 1 manual syringes)
– Motor-controlled y– axis for multi-drop experiments
– Droplet volume < 5 µl
– Location: Zone 16
Documentation
Equipment Description
Responsibles
J. Dorsaz
Equipement
– Measurement range : 1 nm and more
– Multi-layers measurements
– Standard spot diameter : 1 to 5 mm
– Micro spot diameter : 500 µm
– Location: Zone 3
Documentation
Manual
Responsibles
R. Juttin
D. Bouvet
Equipement
– Phase shifting interferometry (PSI) for roughness and small steps (< 160 nm)
– Vertical scanning interferometry (VSI) for rough surface and steps up to 1 mm high
– PSI vertial resolution : 0.3 nm
– VSI vertical resolution : 3 nm
– Spacial resolution : 1.0 µm
– Location: Zone 15
Documentation
Manual
Responsibles
C. Hibert
G. Clerc
Equipement
– Location: Zone 15
Documentation
Manual
Responsibles
C. Hibert
A. Toros
Equipement
– Measurement range : 10nm up to 20µm
– Spatial resolution : 10µm and wider (spot size depends on objective magnification 4x: 62.5µm, 10x: 25µm, 40x: 6.25µm)
– Mono, bi-layers and tri-layer stack measurements
– Location: Zone 19
Documentation
Manual
Responsibles
J. Dorsaz
G.A. Racine
G. Clerc
Equipement
– Thickness measurement
– Thickness range : 1nm to 40µm
– Thickness and n and k measurement
– Thickness range : 50nm and up
– Wavelength range : 200nm – 1100nm
– Spot size : 1.5mm
– Measurement of Single layers
– Measurement of Multilayer stacks
– Location: Zone 15
Documentation
Manual
Responsibles
J. Dorsaz
G.A. Racine
Filmetrics F54
Equipement
– Measurement range : 10nm up to 40µm
– Spatial resolution : 33µm (500um aperture)
– Mono, bi-layers and tri-layer stack measurements
– Location: Zone 3
Documentation
Manual
Responsibles
N. Piacentini
J. Dorsaz
G.A. Racine
R. Juttin
Equipement
– Thin film stress measurement
– Location: Zone 15
Documentation
Manual
Responsibles
C. Hibert
Equipement
– Location: Zone 16
Documentation
Brochure
Responsibles
Junqiu Liu

Electrical measurement

Equipement
– Mesurement range : 5mOhm/¡ to MOhm/¡
– Location: Zone 4
Documentation
Manual
Responsibles
D. Bouvet
G. Clerc
Equipement
– DC electrical measurements with up to 4 probes
– Tungsten tips with 12um radius
– Stage travel with fine and coarse mode, up to 200mm x 200mm
– Configurations for resistivity, diode, FET and Bipolar transistors
– Location: Zone 11
Documentation
Equipment Description
User Manual
Responsibles
G.A. Racine

Optical microscopy

Equipements
– Nikon Optiphot 200
– Nikon Optiphot 150
– … To be defined with GAR
Documentation
– Manual