BACHELOR / MASTER STUDENTS

REQUIREMENTS

Students applying for internships must either be awarded credits for their work (e.g. master thesis) or provide their own funding (e.g. non-credited summer internship).

Registered EPFL bachelor and master students

You should organise your agenda to be on site, in Geneva, for at least a full day per week. The travel costs between EPFL Lausanne and EPFL Geneva will be covered.

External students from a partner University

The list of partner universities can be found here. To join the LSBI, you should register first through EPFL academic services – please check the following website for additional information.

External students from a non-partner University

You are welcome to apply to join the LSBI, but you will need to find your own funding source e.g. a scholarship, a grant, etc.

Fellowships

Foreign students are welcome to apply to one of the following schemes to join the LSBI for a summer, a semester or a year-long internship.

EPFL Excellence in Engineering, E3 program for Summer internship

Zeno Karl Schindler Summer School grant

Swiss Government Excellence Fellowship

INTERNSHIP, SEMESTER AND MASTER PROJECTS

3D Bioprinting of Sacrificial Stiffening Layers for Self-Inserting Needles on Peripheral Nerve Interfaces

Semester project

This project focuses on developing and optimizing a bioprinting process to pattern a sacrificial stiffening layer onto an advanced peripheral nerve cuff with high–aspect-ratio microneedles. The coating is designed to temporarily support and protect the microneedles during implantation, when the cuff must wrap around the nerve and is exposed to tangential forces that could bend or damage the structures.

The sacrificial layer provides short-term mechanical support and protection during handling and implantation, and subsequently dissolves in biological fluids to allow the microneedles to self-insert within the nerve. The student will establish and refine an extrusion bioprinting workflow to reliably deposit this layer with high precision and reproducibility. Initial work will be carried out on dummy substrates and, depending on progress, may extend to functional neural interfaces.

Project Goals

  • Operate and Understand the Extrusion Bioprinter
    • Learn the full workflow of an extrusion-based bioprinter.
    • Study how printing parameters (extrusion rate, printhead speed, nozzle diameter) affect print result and repeatability.
    • Test different options for substrate preparation to improve the prints
  • Optimize the Sacrificial Printing Solution: Create and refine formulations that are:
    • easy to extrude and capable of high-resolution printing,
    • mechanically stiff once solidified to effectively protect the needles during implantation,
    • fully water-soluble to allow dissolution and subsequent self-insertion.
  • Design and Optimize Printing Patterns
    • Use CAD and slicing tools to design printing patterns that align with microneedle geometry.
    • Tune pattern geometry (e.g., line spacing, layer height) and post-processing steps to achieve consistent coverage and protective shape.
  • Morphological and Structural Analysis
    • Characterize printed features using optical microscopy and SEM.
    • Evaluate fidelity, uniformity, spreading, drying behavior, and adhesion.
  • Dissolution and Functional Performance
    • Measure dissolution kinetics in aqueous or physiological buffers.
    • Optionally perform mechanical bench tests to assess whether the printed layer effectively stabilizes the needles under tangential forces.

Must-Have Skills

  • Strong motivation and curiosity in bioelectronics, neural interfaces, and flexible electronics.
  • Basic understanding of neural interfaces and 3D printing techniques.
  • Interest in hands-on experimental work, data analysis, and iterative problem-solving.

Nice-to-Have Skills

  • Basic knowledge of hydrogels, polymers or fluid rheology.
  • Experience with CAD/slicing/g-code for 3D printing.
  • Exposure to optical microscopy or SEM.

To apply, please contact Angela Braccia or Scott Erickson

 

Stretchable Neural Interfaces: Designing and Testing a Custom Platform for Mechanical and Electrochemical Characterization

Semester project

This project aims to study the mechanical and electrochemical stability of a novel stretchable hybrid extraneural/intraneural peripheral nerve interface. The student will assist in microfabrication of the device and contribute to the design and implementation of a custom stretching platform that enables simultaneous mechanical loading and electrochemical characterization.

Stretchability in the design is leveraged to facilitate implantation, allowing the interface to adapt to different nerve diameters while ensuring proper locking around the nerve once implanted. As stretching during implantation could affect device functionality, it is essential to evaluate the mechanical limits and electrical stability of the system under strain.

The student will carry out electrochemical characterization under controlled strain to assess conductivity stability, followed by optical and SEM imaging to identify cracking or delamination. Based on the results, the project may also include modelling and design optimization to enhance stretchability and mechanical reliability.

Project Goals

  • Device Fabrication
    • Gain hands-on experience by assisting in the microfabrication of the stretchable hybrid nerve interface.
  • Test Platform Design
    • Collaborate with the lab engineer to design and develop a custom stretching platform for combined mechanical and electrochemical testing.
  • Electrochemical and Physical Characterization
    • Perform electrochemical characterization under controlled strain to evaluate conductivity and impedance stability.
    • Quantify changes in electrical performance under mechanical load and repeated strain cycles.
  • Failure and Structural Analysis
    • Use optical microscopy and SEM to identify cracks, delamination, or interconnect failure.
    • Correlate mechanical deformation with electrochemical degradation to define safe operating limits for the device.
  • Design Optimization
    • Contribute to modelling and redesign of the interface based on experimental results to enhance stretchability and mechanical reliability.

Must-Have Skills

  • Strong motivation and curiosity in bioelectronics, neural interfaces, and flexible electronics.
  • Basic knowledge of microfabrication and mechanical/electrical testing.
  • Interest in hands-on experimental work, data analysis, and independent problem-solving.

Nice-to-Have Skills

  • Experience with CAD tools (e.g., AutoCAD) for mechanical design or test platform development.
  • Experience with cleanroom microfabrication (e.g., photolithography, sputtering, etching).
  • Familiarity with electrochemical or mechanical testing platforms.
  • Exposure to microscopy techniques (optical, SEM).
  • Interest or basic experience in mechanical or finite element modelling (e.g., COMSOL).

To apply, please contact Angela Braccia

Endovascular Neural Interface Concepts

Semester project

This project explores the development of novel endovascular implants that interact with the nervous system through the vasculature. The student will contribute to advancing minimally invasive neurotechnology by working on one of several possible aspects:

  • Design and Simulation: Modelling implant deployment and electrical fields in vascular environments.
  • Fabrication: Prototyping flexible, stent-like structures using thin-film or microfabrication techniques.
  • Characterisation: Assessing mechanical behaviour, electrochemical stability, or biocompatibility of prototypes.
  • System Integration: Exploring connection strategies, packaging, or early signal/power transfer approaches.

Project Outcomes
Depending on the chosen focus, outcomes may include new implant design iterations, validated mechanical/electrical characterisation, or a data/simulation framework guiding future prototypes.

Requirements

  • Background in at least one relevant field (microfabrication, electronics, materials science, biomedical engineering).
  • Interest in medical devices and neurotechnology.
  • Ability to work independently and contribute within an interdisciplinary environment.

Nice-to-have

  • Experience with COMSOL, ANSYS, or other FEM tools.
  • Cleanroom or lab experience.
  • Familiarity with biomedical signal processing.

To apply (or for more information): William Esposito

High-Density Electrode Arrays by Integration CMOS Chips on Thin-Film Devices

Master’s thesis

This project aims to advance neural interface technology by exploring the integration of a commercial high-channel recording chip (the Nixel 512 chip from Science Corporation) with the soft, flexible implantable arrays developed at the Laboratory for Soft Bioelectronic Interfaces (LSBI). Utilizing flip-chip bonding, we will integrate a high-performance silicon recording chip with our soft electrode arrays, offering an avenue to increase the density and channel count of our devices.

The project will focus on the fabrication and characterization of implantable electrocorticography (ECoG) arrays incorporating the Nixel chips.

Project Goals:

  • Cleanroom Microfabrication:
    • Fabricate the high-density electrode arrays.
    • Optimize the flip-chip bonding of bare dies onto thin-film polymeric substrates, adapted to the selected chip.
  • ·Characterization:
    • Characterize electrically and electrochemically the performance of fabricated devices.
    • Assess the reliability of the flip-chip bonding process with the selected chip.

Must-have Competencies:

  • Strong motivation and interest in the development of novel neural interfaces for biomedical applications.
  • Theoretical knowledge of standard microfabrication and photolithography processes.
  • Strong understanding of electrophysiology and the basics of bioelectronic interfaces.
  • Good problem-solving skills and an ability to work independently within an interdisciplinary team environment.

Nice-to-have Competencies:

  • Experience working in a cleanroom environment.
  • Experience in bench testing of neural interfaces.

To apply (or for more information): Horacio Londoño Ramírez

Development of Flexible Field Effect Transistor (FET)-Based Sensors for Neural Biosensing Applications

Master Thesis

This project focuses on the development of flexible Field Effect Transistor (FET)-based sensors designed for biosensing neural signals, including neurotransmitters and other biomarkers such as metabolites or proteins relevant to neural activity. The goal is to enhance neural signal recordings with biochemical insights, offering a better understanding of the neural microenvironment and advancing neuroprosthetics, diagnostics, and bioelectronic medicine.

Project Goals:

  • Design and Fabrication:
    • Develop flexible FET-based sensors with high sensitivity for neural biomarkers.
    • Optimize the fabrication process for reproducibility.
  • Surface Functionalization:
    • Test the stability and selectivity of functionalized sensors under different conditions.
  • Electrical and Biochemical Characterization:
    • Evaluate sensor performance parameters such as sensitivity, limit of detection, and response time.
  • Application in Neural Biosensing:
    • Demonstrate the potential of these sensors to complement neural signal recordings by detecting key neurotransmitters (e.g., dopamine, glutamate) or other biomarkers associated with neural activity.

Must-Have skills:

  • Motivation and interest in applying biosensors in neuroscience and other biomedical applications.
  • Basic understanding of Field Effect Transistor (FET) principles and biosensor mechanisms.
  • Familiarity with neurophysiology, including biomarkers and their significance in neural processes.
  • Team-oriented and collaborative mindset.

Nice-to-Have skills:

  • Experience with microfabrication techniques and cleanroom processes.
  • Knowledge of bioreceptor immobilization strategies (e.g., covalent bonding, adsorption).
  • Familiarity with sensor testing in different media (e.g., buffers, biological fluids).
  • Understanding of materials science, especially in the context of flexible and biocompatible substrates.
  • Knowledge of CAD software and 3D printing for sensor integration and packaging.

References:

Zhao, C., Cheung, K. M., Huang, I.-W., Yang, H., Nakatsuka, N., Liu, W., Cao, Y., Man, T., Weiss, P. S., Monbouquette, H. G., & Andrews, A. M. (2021). Implantable aptamer–field-effect transistor neuroprobes for in vivo neurotransmitter monitoring. Science Advances, 7(48), eabj7422. https://doi.org/10.1126/sciadv.abj7422

To apply, please contact: Desirée Maulá

Electrically-Induced Insulin Secretion from Pancreatic β-Cells: Development of Next-Generation Bioelectronic Platforms

Semester project/Master thesis

This project invites you to explore the frontier of bioelectronic medicine by developing soft, implantable microelectrode systems that can control cellular function—starting with pancreatic β-cells. By combining microfabrication, electrical stimulation, and real-time biochemical monitoring, we aim to lay the groundwork for future implantable therapies for diabetes.

You will build on a semester project that successfully triggered insulin secretion using direct electrical stimulation of β-cells. Now, the challenge is to improve the design, reliability, and functionality of the system: a microfabricated interface that can deliver stimulation precisely, safely, and repeatedly, bringing us one step closer to soft electronic therapies for endocrine disorders.

If you’re curious about how to bring together engineering, biology, and design to make a real impact, this project is for you.

Project Goals

  • Develop a new generation of wafer-based soft electrode arrays compatible with standard multi-well formats.
  • Optimize electrode layout to test different geometries and materials for enhanced biocompatibility and signal uniformity.
  • Integrate the microfabricated electrodes into culture-compatible well plates.
  • Explore innovative packaging methods to achieve leak-proof adhesion between wafers and plastic structures.
  • Ensure reliable electrical interfacing (silver paste, wire bonding, or custom connectors).
  • Perform cell viability and stimulation experiments with Ins-1 E-luc cells.
  • Refine stimulation protocols (pulse width, frequency, amplitude) and evaluate insulin secretion using real-time luminescence.
  • Benchmark performance against prior prototypes to evaluate improvements.
  • Implement multi-zone stimulation capability for parallelized testing.
  • Combine electrical readout with ELISA quantification for absolute insulin measurements.

Must-Have skills

  • Strong interest in bioelectronic interfaces and neuro/bioengineering.
  • Basic knowledge of microfabrication and cleanroom processes.
  • Ability to work independently and troubleshoot experimental issues.

Nice-to-Have skills

  • Experience with AutoCAD or similar design tools.
  • Prior lab experience with biological cultures or electrical stimulation.
  • Familiarity with electrical stimulation setups

To apply, please contact Pietro Palopoli

Designing the Future of Wireless Neural Interfaces: Microfabrication of Coils and Antennas for Soft Bioelectronics

Semester project / Master Thesis

This project invites you to the cutting edge of neurotechnology: building ultra-flexible, wireless neural interfaces through microfabrication of thin-film antennas and power coils. The ultimate goal? A fully implantable ECoG platform for small animal models—without bulky connectors or rigid PCBs.

In the previous semester, we successfully fabricated and tested thin-film coils and antennas for wireless power and communication. We explored RF performance, biocompatible materials, and design trade-offs to develop coils and antennas that are both highly functional and extremely flexible.

In the next stage, we will push the limits of wireless design: integrating optimized power coils and Bluetooth-compatible antennas directly into soft, implantable substrates, ready to be connected with active electronics.

If you’re excited by the idea of combining microfabrication, wireless systems, and soft neurotechnology to create the future of brain-computer interfaces, this project is for you.

Project Goals

  • Refine the design of flexible single-layer and multilayer coils for wireless power transfer at ~13.56 MHz.
  • Improve antenna layout and matching networks for operation in the Bluetooth band (2.4–2.5 GHz).
  • Fabricate devices using polyimide-based thin-film technology with micron-level copper thickness.
  • Optimize process flow for via-hole fabrication and encapsulation (Ecoflex or multilayer coatings).
  • Realize streatchable coils and assess their functionality
  • Measure RF performance (S11/S21) of fabricated structures using vector network analyzers and in-tissue phantoms.
  • Validate power transfer capability and electromagnetic coupling using LED load tests and impedance matching.
  • Evaluate mechanical properties and perform bending/fatigue tests using standardized protocols.
  • Integrate the coils/antennas with functional Bluetooth modules.

Must-Have skills

  • Motivation to work at the intersection of microfabrication, wireless electronics, and neurotechnology.
  • Basic Understanding of electrical engineering and RF principles.
  • Familiarity with cleanroom processes and photolithography.
  • Basic knowledge of neural interfaces or soft electronics..

Nice-to-Have skills

  • Microfabrication experience.
  • Prior work on PCB or antenna design (e.g., ADS, HFSS, Sim4Life).
  • Familiarity with simulation tools (COMSOL)
  • Familiarity with firmware programming

To apply, please contact Pietro Palopoli

Electrodeposition of Antennas, Coils, and Microbumps for Wireless Neurotechnologies

Semester project

This full-time summer semester project invites you to explore the power of electrodeposition to fabricate high-performance metal structures, such as antennas, inductive coils, and microbumps, for next-generation soft bioelectronic systems.

In this project, you will develop and optimize electrodeposition protocols to realize functional coils and antennas for wireless power transfer and communication. In parallel, you will work on the electrodeposition of microbumps for flip-chip bonding, an essential process for connecting active electronics to soft, implantable substrates.

You will gain hands-on experience in cleanroom microfabrication and characterization techniques, learning how to control metal morphology, thickness, and performance to meet stringent requirements in flexible and biointegrated electronics.

If you are excited about working at the interface of microsystems engineering, bioelectronics, and wireless communication, this is a unique opportunity to build foundational skills in a highly active research area.

Project Goals

  • Optimize copper and gold electrodeposition for fabricating thin-film antennas, inductive coils, microbumps.
  • Tune parameters such as current density, plating time, mask geometry, and agitation for thicknesses ranging from 2 to 30 µm.
  • Assess the electrical and functional outcome of your production.
  • Apply standard cleanroom processes (polyimide processing, photolithography, lift-off, laser cutting).
  • Integrate metal structures into coil or antenna layouts for test and validation.
  • Prepare test platforms for electrical interfacing and packaging.
  • Measure electrical and RF performance (e.g., S11/S21 via vector network analyzer, resistance, and inductance).
  • Analyze metal morphology and roughness (optical profilometry, SEM).

Must-Have skills

  • Strong motivation to learn microfabrication techniques and work in a cleanroom environment.
  • Basic knowledge of materials science, electrochemistry, or electrical engineering.
  • Interest in wireless power transfer, flexible electronics, or implantable systems.
  • Curiosity and self-initiative in experimental troubleshooting.

Nice-to-Have skills

  • Experience with cleanroom tools (spin-coating, mask aligner, profilometer, etc.).
  • Knowledge of electrochemical deposition or RF testing (e.g., VNAs).
  • Familiarity with MATLAB/Python for data analysis.

To apply, please contact Pietro Palopoli

Microbump-Based Electrical Interconnects for High-Density Neural Interfaces

Semester project/Master Thesis

This project tackles one of the core challenges in advanced neural engineering: developing reliable, low-impedance, and mechanically robust electrical connections between high-channel-count silicon microchips and soft implantable substrates.

In this project, you will explore and optimize microbump-based flip-chip bonding strategies to integrate high-density microchips onto flexible thin-film platforms. These interconnects are essential to enable chronic implants capable of recording from thousands of neural channels.

You will work hands-on in the cleanroom, developing processes for the realization, optimization, and characterization of metal microbumps, assessing how their geometry, material, and bonding method affect their electrical and mechanical performance.

If you’re passionate about microfabrication, neurotechnology, and solving engineering problems that directly impact the future of brain-computer interfaces, this is your project.

Project Goals

  • Fabricate microbumps using electrodeposition or stencil printing on flexible polymeric substrates and/or silicon dies.
  • Compare different materials (e.g., copper, gold) and bump geometries for bonding suitability.
  • Explore bonding methods (thermal compression, ultrasonic, reflow) and their impact on bump quality.
  • Measure impedance and resistance of microbump interconnects across channel arrays.
  • Evaluate mechanical reliability through shear tests, adhesion, and fatigue cycles.
  • Perform post-bonding inspection via profilometry, microscopy, and electrical continuity tests.
  • Assess the feasibility of scaling the interconnect technology to >1000 channels.
  • Analyze signal integrity and contact yield across dense arrays.

Must-Have skills

  • Strong interest in microfabrication, electronics packaging, or neural engineering.
  • Basic knowledge of cleanroom processes and electrical characterization.
  • Solid problem-solving skills and a detail-oriented approach to experimental work.
  • Willingness to work independently and iterate on experimental designs..

Nice-to-Have skills

  • Experience with wire bonding, flip-chip bonding, or electrodeposition.
  • Familiarity with tools like SEM, profilometer, or impedance analyzers.
  • Background in microelectrode arrays or neural signal acquisition.

To apply, please contact Pietro Palopoli

Electrochemical Aging of PEDOT-Coated Neural Interfaces: Characterizing Long-Term Stimulation Stability

Semester project

This project focuses on understanding the long-term electrochemical stability of PEDOT-coated active sites in a novel peripheral nerve interface. PEDOT (poly(3,4-ethylenedioxythiophene)) is a widely used conducting polymer in neural implants due to its excellent electrochemical properties and biocompatibility. However, its structural and functional degradation—especially under prolonged electrical stimulation—remains a critical barrier to reliable long-term implantation.

The primary goal of this project is to evaluate the range of stimulation currents that can be safely applied without compromising the integrity of the PEDOT coating, while also studying how in vivo-like mechanical and chemical conditions contribute to its degradation or delamination. This includes assessing electrical fatigue, chemical aging, and mechanical stress, with the ultimate goal of improving implant longevity.

Project Goals

  • Device Fabrication
    Gain some hands-on experience, assisting in device fabrication.
  • PEDOT Deposition
    Learn and apply electrochemical polymerization techniques to deposit PEDOT on electrode surfaces.
  • Electrochemical and Physical Characterization
    • Use electrochemical impedance spectroscopy (EIS) and cyclic voltammetry (CV) to assess coating properties.
    • Quantify charge injection capacity, impedance stability, and surface integrity over time.
  • Aging and Stress Testing
    • Apply prolonged electrical stimulation protocols at varying current levels to evaluate electrochemical fatigue.
    • Conduct passive chemical aging in PBS at physiological or elevated temperatures to simulate in vivo conditions.
    • Perform mechanical stress tests, including:
      • Ultrasonic agitation (sonication).
      • Insertion into explanted nerve tissue to evaluate mechanical resilience and adhesion during penetration.
  • Failure and Adhesion Analysis
    • Analyze degradation using electrochemical measurements and scanning electron microscopy (SEM).
    • Identify signs of delamination, cracking, or coating detachment, which may indicate adhesion issues.

Must-Have Skills

  • Strong motivation and curiosity in neural interfaces and bioelectronics.
  • Basic knowledge of microfabrication and cleanroom processes.
  • Interest in experimental troubleshooting and independent research.

Nice-to-Have Skills

  • Experience with cleanroom microfabrication (e.g., photolithography, sputtering, etching).
  • Familiarity with electrochemical or mechanical testing platforms.
  • Exposure to microscopy techniques (optical, SEM)

To apply, please contact Angela Braccia

Long-Term Stability and Performance Assessment of Chronically Implanted Electrode Arrays

Semester project – Autumn semester

At the Laboratory for Soft Bioelectronic Interfaces, we develop soft, flexible implantable electrode arrays for brain recordings and spinal cord stimulation. We are currently seeking a motivated student to assist with the evaluation of the long-term stability and performance of our electrode arrays.

As part of an ongoing project, we have chronically implanted state-of-the-art electrocorticography (ECoG) arrays over the brain surface of a non-human primate. Over the past several months, we have been collecting data related to both neural activity recordings and electrode impedance.

This project will focus on analyzing previously collected data to assess the long-term stability and performance of chronically implanted electrode arrays. The student will contribute to the development of a data analysis pipeline to evaluate electrode status using metrics derived from neural signal quality and impedance measurements. Specifically, the work will involve longitudinal analysis of signal noise and crosstalk (inter-electrode correlations), tracking temporal changes in electrode impedance, and exploring potential relationships between impedance and electrophysiological activity.

Project Goals

  • Evaluate the long-term stability and performance of chronically implanted electrode arrays
  • Develop data analysis pipeline
  • Analyze results and draw conclusions to guide the design of the next generation of implants

Must-have Competencies

  • Strong level in coding (Python)
  • Strong data analysis and signal processing skills
  • High motivation and interest in analyzing electrophysiological data and contributing to the development of novel neural interfaces for biomedical applications
  • Problem-solving skills and the ability to work independently in an interdisciplinary research environment

Nice-to-have Competencies

  • Basic knowledge of electrophysiology and bioelectronic interfaces

References

  • Schiavone, Giuseppe, et al. “Guidelines to study and develop soft electrode systems for neural stimulation.” Neuron 108.2 (2020): 238-258.
  • Lewis, Christopher M., et al. “Recording quality is systematically related to electrode impedance.” Advanced Healthcare Materials 13.24 (2024): 2303401.
  • Porto Cruz, Maria F., et al. “Bridging circuit modeling and signal analysis to understand the risk of crosstalk contamination in brain recordings.” Nature Communications 16.1 (2025): 4744.
  • Boehler, Christian, et al. “Tutorial: guidelines for standardized performance tests for electrodes intended for neural interfaces and bioelectronics.” Nature protocols 15.11 (2020): 3557-3578.

To apply (or for more information): Horacio Londoño Ramírez, Laurine Kolly, Victor Druet