F. Bersano; M. Aldeghi; N. Martinolli; V. Boureau; T. Aboud et al.
Advanced Functional Materials. 2025. DOI : 10.1002/adfm.202419940.F. De Palma; F. Oppliger; W. Jang; S. Bosco; M. Janík et al.
Nature communications. 2024. Vol. 15, num. 1. DOI : 10.1038/s41467-024-54520-7.A. Ranni; S. Haldar; H. Havir; S. Lehmann; P. Scarlino et al.
Physical Review Research. 2024. Vol. 6, num. 4, p. 043134. DOI : 10.1103/PhysRevResearch.6.043134.A. Nigro; E. Jutzi; F. Oppliger; F. De Palma; C. Olsen et al.
ACS Applied Electronic Materials. 2024. Vol. 6, num. 7, p. 5094 – 5100. DOI : 10.1021/acsaelm.4c00654.S. Frasca; C. Roy; G. Beaulieu; P. Scarlino
Physical Review Applied. 2024. Vol. 21, p. 024011. DOI : 10.1103/PhysRevApplied.21.024011.J. H. Ungerer; A. Pally; A. Kononov; S. Lehmann; J. Ridderbos et al.
Nature Communications. 2024. Vol. 15, num. 1, p. 1068. DOI : 10.1038/s41467-024-45235-w.S. Frasca; I. Arabadzhiev; S. Y. Bros de Puechredon; F. Oppliger; V. Jouanny et al.
Physical Review Applied. 2023. Vol. 20, p. 044021. DOI : 10.1103/PhysRevApplied.20.044021.F. Bersano; M. Aldeghi; E. Collette; M. Ghini; F. D. Palma et al.
2023. 2023 IEEE Symposium on VLSI Technology and Circuits, Kyoto, Japan, 2023-06-11 – 2023-06-16. p. 1 – 2. DOI : 10.23919/VLSITechnologyandCir57934.2023.10185278.M. Scigliuzzo; G. Calajo; F. Ciccarello; D. P. Lozano; A. Bengtsson et al.
Physical Review X. 2022. Vol. 12, num. 3, p. 031036. DOI : 10.1103/PhysRevX.12.031036.S. Bosco; P. Scarlino; J. Klinovaja; D. Loss
Physical Review Letters. 2022. Vol. 129, num. 6, p. 066801. DOI : 10.1103/PhysRevLett.129.066801.F. Bersano; F. De Palma; F. Oppliger; F. Braakman; I. Radu et al.
2022. 48th IEEE European Solid State Circuits Conference (ESSCIRC), Milan, ITALY, 2022-09-19 – 2022-09-22. p. 49 – 52. DOI : 10.1109/ESSCIRC55480.2022.9911479.B. Kratochwil; J. V. Koski; A. J. Landig; P. Scarlino; J. C. Abadillo-Uriel et al.
Physical Review Research. 2021. Vol. 3, num. 1, p. 013171. DOI : 10.1103/PhysRevResearch.3.013171.A. Laucht; F. Hohls; N. Ubbelohde; M. F. Gonzalez-Zalba; D. J. Reilly et al.
Nanotechnology. 2021. Vol. 32, num. 16, p. 162003. DOI : 10.1088/1361-6528/abb333.J. V. Koski; A. J. Landig; M. Russ; J. C. Abadillo-Uriel; P. Scarlino et al.
Nature Physics. 2020. Vol. 16, num. 6, p. 642 – 646. DOI : 10.1038/s41567-020-0862-4.A. J. Landig; J. V. Koski; P. Scarlino; C. Müller; J. C. Abadillo-Uriel et al.
Nature Communications. 2019. Vol. 10, num. 1, p. 5037. DOI : 10.1038/s41467-019-13000-z.P. Scarlino; D. J. van Woerkom; U. C. Mendes; J. V. Koski; A. J. Landig et al.
Nature Communications. 2019. Vol. 10, num. 1, p. 3011. DOI : 10.1038/s41467-019-10798-6.A. Landig; J. Koski; P. Scarlino; C. Reichl; W. Wegscheider et al.
Physical Review Letters. 2019. Vol. 122, num. 21, p. 213601. DOI : 10.1103/PhysRevLett.122.213601.P. Scarlino; D. van Woerkom; A. Stockklauser; J. Koski; M. Collodo et al.
Physical Review Letters. 2019. Vol. 122, num. 20, p. 206802. DOI : 10.1103/PhysRevLett.122.206802.C. Maruccio; M. Scigliuzzo; S. Rizzato; P. Scarlino; G. Quaranta et al.
Journal of Intelligent Material Systems and Structures. 2019. Vol. 30, num. 6, p. 801 – 812. DOI : 10.1177/1045389X18803461.