2026
Journal Articles
Flow boiling heat transfer in a lotus leaf-inspired microchannel heat sink with enhanced critical heat flux for large area chips
Energy Conversion and Management. 2026. Vol. 348, p. 120795. DOI : 10.1016/j.enconman.2025.120795.Integrated Thermal Management for a High-Power-Density Silicon Carbide Power Module With Die-Level Heat Flux Over 1000 W/cm2
Ieee Journal Of Emerging And Selected Topics In Power Electronics. 2026. Vol. 13, num. 2, p. 2125 – 2137. DOI : 10.1109/JESTPE.2024.3524214.2025
Journal Articles
Dynamic Heterogeneous Multi-Agent Inverse Reinforcement Learning Based on Graph Attention Mean Field
Symmetry. 2025. Vol. 17, num. 11. DOI : 10.3390/sym17111951.Charge dynamics in spacecraft polymers: Trap-modulated mechanisms from bulk accumulation to surface secondary electron emission
AIP Advances. 2025. Vol. 15, num. 11. DOI : 10.1063/5.0294989.Verification of techniques for accelerated and stable SOLPS-ITER simulations including plasma drifts
Nuclear Fusion. 2025. Vol. 65, num. 11, p. 116001. DOI : 10.1088/1741-4326/ae0950.Advanced IGBT Module Design for Enhanced Overcurrent Capability Using Phase Change Materials
Journal of Electronic Packaging. 2025. p. 1 – 31. DOI : 10.1115/1.4070159.Design and 3D Printing of Ceramic Insulation for Surface Flashover Mitigation in Vacuum
High Voltage. 2025. DOI : 10.1049/hve2.70104.Porous Lightweight Polyimide Films with Ultra-High Surface Insulation Strength and Thermal Insulation for Space Solar Arrays
ACS Applied Materials & Interfaces. 2025. DOI : 10.1021/acsami.5c16114.Three-Dimensional Simulation-Based Comparison of Streamer Initiation in SF6/N2 and SF6/CO2 for Different Mixing Ratios and Pressures
Applied Sciences. 2025. Vol. 15, num. 19. DOI : 10.3390/app151910331.Thermal responses and flow instability of manifold ring-microchannel heat sink applied for periodic heat flow conditions
Journal of Applied Physics. 2025. Vol. 138, num. 12. DOI : 10.1063/5.0283217.Response to comment on âGlobal model for flashover phenomena in vacuum: A comprehensive perspectiveâ [J. Appl. Phys. 137, 100901 (2025)]
Journal of Applied Physics. 2025. Vol. 138, num. 11. DOI : 10.1063/5.0277906.Numerical investigation of vacuum surface flashover triggered by inverted potential gradient on solar cells using particle-in-cell method
Journal of Applied Physics. 2025. Vol. 138, num. 11. DOI : 10.1063/5.0288856.Terahertz Electronic Metadevices: Principles behind the Ultra-high Cutoff Frequency
IEEE Electron Device Letters. 2025. Vol. 46, num. 11, p. 1986 – 1989. DOI : 10.1109/LED.2025.3606749.2.7 Kv E-mode Multichannel Gan-on-si Based on P-type Nio/sio2 Junction Tri-gate
IEEE ELECTRON DEVICE LETTERS. 2025. Vol. 46, num. 9, p. 1589 – 1592. DOI : 10.1109/LED.2025.3584531.First-principle model of multipactor discharge considering realistic surface morphology: the role of microstructures
Plasma Sources Science and Technology. 2025. Vol. 34, num. 9, p. 095002. DOI : 10.1088/1361-6595/adffe5.Trap State Modulation via Strong Electron-Withdrawing Groups for Enhanced Vacuum Surface Insulation of All-Organic Polyimide
ACS applied materials & interfaces. 2025. Vol. 17, num. 34, p. 48956 – 48966. DOI : 10.1021/acsami.5c10530.Neutral pressure measurement in TCV tokamak using ASDEX-type pressure gauges
Review of Scientific Instruments. 2025. Vol. 96, num. 8, p. 083502. DOI : 10.1063/5.0278364.LowâPower Tunable MicroâPlasma Device for Efficient and Scalable CO2 Valorization
Advanced Science. 2025. DOI : 10.1002/advs.202507687.Dynamic Charge Transport Behavior of Double-layer Thin Film Materials Under Electron Beam Irradiation
JOURNAL OF PHYSICS D-APPLIED PHYSICS. 2025. Vol. 58, num. 23. DOI : 10.1088/1361-6463/add746.p-NiO/LiNiO-GaN heterojunctions: a potential alternative to p-GaN for advanced devices
IEEE Electron Device Letters. 2025. DOI : 10.1109/LED.2025.3549252.Uniform and Efficient Embedded Microfluidic Cooling for High-Power-Density Power Modules
IEEE Transactions on Power Electronics. 2025. DOI : 10.1109/TPEL.2025.3584306.Safe-Operation-Area Extended IGBT Module With Enhanced Near-Junction Thermal Capacitance and Advanced Cooling for Transient High-Current Operation
IEEE Transactions on Power Electronics. 2025. p. 1 – 14. DOI : 10.1109/tpel.2025.3615245.Conference Papers
Integration of Jet Impingement with Enhanced Pin Fin Structures for In-Chip Cooling of Power Electronics
2025. 2025 31st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Naples, Italy, 2025-09-24 – 2025-09-26. p. 1 – 4. DOI : 10.1109/therminic65879.2025.11216913.Investigation of Dynamic RON in p-GaN Gate HEMTs under Steady-State Soft-Switching: Roles of OFF-State Trapping and Hole Injections
2025. 37th International Symposium on Power Semiconductor Devices and ICs, Kumamoto, Japan, 2025-06-01 – 2025-06-05. p. 257 – 260. DOI : 10.23919/ispsd62843.2025.11117437.Efficient Chip-Integrated Microfluidic Cooling Through Jet-Enhanced Manifold Microchannels
2025. 2025 31st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Naples, Italy, 2025-09-24 – 2025-09-26. DOI : 10.1109/THERMINIC65879.2025.11216871.Reviews
A review of advanced acoustic-chemical-optical partial discharge monitoring techniques for ultra-high-voltage gas-insulated equipment
High Voltage. 2025. Vol. 10, num. 4, p. 787 – 806. DOI : 10.1049/hve2.70086.A review of thermal management of batteries with a focus on immersion cooling
Renewable and Sustainable Energy Reviews. 2025. Vol. 217, p. 115751. DOI : 10.1016/j.rser.2025.115751.Patents
Nanoplasma switch device for ultrafast switching
US2023360875; WO2021190955.
2025.2024
Journal Articles
Soft-Switching CO Hysteresis Losses in GaN HEMTs: A Resonant-Sawyer-Tower Measurement Method
IEEE Transactions on Power Electronics. 2024. p. 1 – 11. DOI : 10.1109/TPEL.2024.3443645.In-Chip Microfluidic Cooling Integrated on GaN Power IC Reaching High Power Density of 78 kW/l
IEEE Transactions on Power Electronics. 2024. Vol. 39, num. 8, p. 9717 – 9723. DOI : 10.1109/TPEL.2024.3396508.Numerical study on a new manifold ring-shaped microchannel structure for circular heat source with excellent temperature uniformity
INTERNATIONAL JOURNAL OF THERMAL SCIENCES. 2024. Vol. 204. DOI : 10.1016/j.ijthermalsci.2024.109225.Direct high-temperature growth of GaN on Si using trimethylaluminum preflow enabling vertically-conducting heterostructures
Japanese Journal Of Applied Physics. 2024. Vol. 63, num. 6, p. 060904. DOI : 10.35848/1347-4065/ad5480.Polarization-enhanced GaN Schottky barrier diodes: Ultra-thin InGaN for high breakdown voltage and low Ron
IEEE Electron Device Letters. 2024. DOI : 10.1109/LED.2024.3395112.Chip-Scale Watt-Range Terahertz Generation Based on Fast Transition in Nanoplasma Switches
IEEE Electron Device Letters. 2024. Vol. 45, num. 6, p. 1072 – 1075. DOI : 10.1109/LED.2024.3387066.Theses
Direct high-temperature MOCVD growth of GaN on foreign substrates
Lausanne, EPFL, 2024.2023
Journal Articles
Accurate Measurement of Dynamic ON-Resistance in GaN Transistors at Steady-State
IEEE Transactions on Power Electronics. 2023. DOI : 10.1109/TPEL.2023.3268890.Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview
IEEE Transactions on Power Electronics. 2023. Vol. 38, num. 3, p. 3569 – 3589. DOI : 10.1109/TPEL.2022.3223730.Electronic metadevices for terahertz applications
Nature. 2023. Vol. 614, num. 7948, p. 451 – +. DOI : 10.1038/s41586-022-05595-z.Conference Papers
Switching losses in power devices: From dynamic on resistance to output capacitance hysteresis
2023. 25th European Conference on Power Electronics and Applications (EPE ECCE Europe), Aalborg, DENMARK, SEP 04-08, 2023. DOI : 10.23919/EPE23ECCEEurope58414.2023.10264510.Measurement of WBG-based power supplies
2023. 25th European Conference on Power Electronics and Applications (EPE ECCE Europe), Aalborg, DENMARK, SEP 04-08, 2023. DOI : 10.23919/EPE23ECCEEurope58414.2023.10264671.Theses
New ultrahigh-speed device concepts: from THz nanoplasma devices to glass-like electronics for neuromorphic computation
Lausanne, EPFL, 2023.2022
Journal Articles
GaN growth on ScAlMgO4 substrates via thermally-dewetted thin Al films
Japanese Journal Of Applied Physics. 2022. Vol. 61, num. 11, p. 118003. DOI : 10.35848/1347-4065/ac980f.Electrical control of glass-like dynamics in vanadium dioxide for data storage and processing
Nature Electronics. 2022. DOI : 10.1038/s41928-022-00812-z.Nanoplasma-based Millimiter-wave Modulators on a Single Metal Layer
IEEE Electron Device Letters. 2022. p. 1 – 1. DOI : 10.1109/LED.2022.3187456.A perspective on multi-channel technology for the next-generation of GaN power devices
Applied Physics Letters. 2022. Vol. 120, num. 19, p. 190501. DOI : 10.1063/5.0086978.Direct high-temperature growth of single-crystalline GaN on ScAlMgO4 substrates by metalorganic chemical vapor deposition
Japanese Journal Of Applied Physics. 2022. Vol. 61, num. 4, p. 048002. DOI : 10.35848/1347-4065/ac54fe.Intrinsic Polarization Super Junctions: Design of Single and Multichannel GaN Structures
IEEE Transactions on Electron Devices. 2022. Vol. 69, p. 1798 – 1804. DOI : 10.1109/TED.2022.3151558.Enhancement-mode Multi-channel AlGaN/GaN Transistors with LiNiO Junction Tri-Gate
IEEE Electron Device Letters. 2022. p. 1 – 1. DOI : 10.1109/LED.2022.3189635.A Generalized Phase-Shift PWM Extension for Improved Natural and Active Balancing of Flying Capacitor Multilevel Inverters
Ieee Open Journal Of Power Electronics. 2022. Vol. 3, p. 621 – 634. DOI : 10.1109/OJPEL.2022.3209540.p-GaN field plate for low leakage current in lateral GaN Schottky barrier diodes
Applied Physics Letters. 2022. Vol. 119, num. 26, p. 263508. DOI : 10.1063/5.0074543.Conference Papers
Beyond 8 THz Displacement-field Nano-switches for 5G and 6G Communications
2022. 67th Annual IEEE International Electron Devices Meeting (IEDM 2021), San Francisco, CA, USA, December 11-16, 2021. p. 4.5.1 – 4.5.4. DOI : 10.1109/IEDM19574.2021.9720575.Theses
Hard and Soft Switching Losses in Power Converters: Role of Transistor Output Capacitance
Lausanne, EPFL, 2022.Near-junction microfluidic cooling for high power-density GaN-on-Si electronics: A wafer, device, packaging, and system-level investigation
Lausanne, EPFL, 2022.LiNiO Junction Gate for High-performance Enhancement-mode GaN Power Transistor
Lausanne, EPFL, 2022.New Technologies to Enhance the Figures-of-Merit of GaN Power Devices
Lausanne, EPFL, 2022.2021
Journal Articles
Hard-Switching Losses in Power FETs: The Role of Output Capacitance
IEEE Transactions on Power Electronics. 2021. Vol. 37, num. 7, p. 7604 – 7616. DOI : 10.1109/TPEL.2021.3130831.Figures-of-Merit of Lateral GaN Power Devices: modeling and comparison of HEMTs and PSJs
IEEE Journal of the Electron Devices Society. 2021. Vol. 9, p. 1066 – 1075. DOI : 10.1109/JEDS.2021.3125742.GaN-based power devices: Physics, reliability, and perspectives
Journal Of Applied Physics. 2021. Vol. 130, num. 18, p. 181101. DOI : 10.1063/5.0061354.Impact of Embedded Liquid Cooling on the Electrical Characteristics of GaN-on-Si Power Transistors
IEEE Electron Device Letters. 2021. Vol. 42, num. 11, p. 1642 – 1645. DOI : 10.1109/LED.2021.3114056.Seed Dibbling Method for the Grow of High-Quality Diamond on GaN
ACS Applied Materials & Interfaces. 2021. Vol. 13, num. 36, p. 43516 – 43523. DOI : 10.1021/acsami.1c08761.Performance of GaN Power Devices for Cryogenic Applications Down to 4.2 K
IEEE Transactions on Power Electronics. 2021. Vol. 36, num. 7, p. 7412 – 7416. DOI : 10.1109/TPEL.2020.3047466.p-NiO junction termination extensions for GaN power devices
Applied Physics Express. 2021. Vol. 14, num. 7, p. 071006. DOI : 10.35848/1882-0786/ac09ff.High conductivity InAlN/GaN multi-channel two-dimensional electron gases
Semiconductor Science And Technology. 2021. Vol. 36, num. 5, p. 055020. DOI : 10.1088/1361-6641/abf3a7.Quasi-vertical GaN-on-Si reverse blocking power MOSFETs
Applied Physics Express. 2021. Vol. 14, num. 4, p. 046503. DOI : 10.35848/1882-0786/abf054.Multi-channel nanowire devices for efficient power conversion
Nature Electronics. 2021. Vol. 4, p. 284 – 290. DOI : 10.1038/s41928-021-00550-8.Kilowatt-range Picosecond Switching Based on Microplasma Devices
IEEE Electron Device Letters. 2021. p. 1 – 1. DOI : 10.1109/LED.2021.3068732.Resonances on GaN-on-Si Epitaxies: A Source of Output Capacitance Losses in Power HEMTs
IEEE Electron Device Letters. 2021. p. 1 – 1. DOI : 10.1109/LED.2021.3064021.Comparison of Wide-Band-Gap Technologies for Soft-Switching Losses at High Frequencies (vol 35, pg 12595, 2020)
IEEE Transactions on Power Electronics. 2021. Vol. 36, num. 2, p. 2444 – 2445. DOI : 10.1109/TPEL.2020.3017073.Parallel PV Configuration with Magnetic-Free Switched Capacitor Module-Level Converters for Partial Shading Conditions
Energies. 2021. Vol. 14, num. 2, p. 456. DOI : 10.3390/en14020456.Optimized kW-Range Boost Converter Based on Impulse Rectification with 52 kW/l and 98.6% Efficiency
IEEE Transactions on Power Electronics. 2021. Vol. 36, num. 7, p. 7389 – 7394. DOI : 10.1109/TPEL.2020.3045062.P-GaN Tri-Gate MOS Structure for Normally-Off GaN Power Transistors
IEEE Electron Device Letters. 2021. Vol. 42, num. 1, p. 82 – 85. DOI : 10.1109/LED.2020.3037026.Conference Papers
Active-Device Losses in Resonant Power Converters: A Case Study with Class-E Inverters
2021. IEEE Energy Conversion Congress and Exposition (ECCE 2021), Vancouver, BC, Canada, October 10-14, 2021. p. 5312 – 5319. DOI : 10.1109/ECCE47101.2021.9594950.High-Performance Enhancement-Mode AlGaN/GaN Multi-Channel Power Transistors
2021. 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD), Nagoya, Japan, May 30-Jun 03, 2021. p. 143 – 146. DOI : 10.23919/ISPSD50666.2021.9452238.Investigation on Output Capacitance Losses in Superjunction and GaN-on-Si Power Transistors
2021. 9th International Power Electronics and Motion Control Conference (IPEMC2020-ECCE Asia), Nanjing, China, 29 Nov.-2 Dec. 2020. DOI : 10.1109/IPEMC-ECCEAsia48364.2020.9367884.Enhanced-DAB Converter: Comprehensive Design Evaluation
2021. 2020 IEEE 9th International Power Electronics and Motion Control Conference (IPEMC2020-ECCE Asia), Nanjing, China, 29 Nov.-2 Dec. 2020. p. 1844 – 1851. DOI : 10.1109/IPEMC-ECCEAsia48364.2020.9368193.LiNiO Gate Dielectric with Tri-Gate Structure for High Performance E-mode GaN transistors
2021. 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD), Nagoya, JAPAN, May 30-Jun 03, 2021. p. 135 – 138. DOI : 10.23919/ISPSD50666.2021.9452252.p-NiO Junction Termination Extensions for High Voltage Vertical GaN Devices
2021. 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD), Nagoya, JAPAN, May 30-Jun 03, 2021. p. 147 – 150. DOI : 10.23919/ISPSD50666.2021.9452255.Radio Frequency Temperature Transducers Based On Insulator-Metal Phase Transition In Vo2 And Ge-Doped Vo2 Ald Thin Films
2021. 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers), ELECTR NETWORK, Jun 20-25, 2021. p. 1355 – 1358. DOI : 10.1109/TRANSDUCERS50396.2021.9495498.Embedded Microchannel Cooling for Monolithically-integrated GaN Half-bridge ICs
2021. 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), ELECTR NETWORK, Sep 23, 2021. DOI : 10.1109/THERMINIC52472.2021.9626476.Microchannel-based Calorimeter for Rapid and Accurate Loss Measurements on High-efficiency Power Converters
2021. 13th IEEE Energy Conversion Congress and Exposition (IEEE ECCE), ELECTR NETWORK, Oct 10-14, 2021. p. 5709 – 5715. DOI : 10.1109/ECCE47101.2021.9595598.Theses
Enhancement Mode Tri-gate GaN Power Devices and Logic Circuits
Lausanne, EPFL, 2021.GaN vertical power devices on silicon substrates
Lausanne, EPFL, 2021.Heterostructure design and field management in III-N high-electron mobility electronic devices
Lausanne, EPFL, 2021.Diamond on GaN integration for power semiconductor devices with efficient thermal management
Lausanne, EPFL, 2021.Pushing the Limits of Efficiency and Power Density in High-Frequency Power Conversion Based on Wide-Band-Gap Technologies
Lausanne, EPFL, 2021.Patents
Integrated electronic device with embedded microchannels and a method for producing thereof
US2023037442; EP4078672; WO2021121560.
2021.2020
Journal Articles
Conformal Passivation of Multi-Channel GaN Power Transistors for Reduced Current Collapse
IEEE Electron Device Letters. 2020. Vol. 42, num. 1, p. 86 – 89. DOI : 10.1109/LED.2020.3038808.Fully Soft-Switched High Step-Up Nonisolated Three-Port DC-DC Converter Using GaN HEMTs
Ieee Transactions On Industrial Electronics. 2020. Vol. 67, num. 10, p. 8371 – 8380. DOI : 10.1109/TIE.2019.2944068.Co-designing electronics with microfluidics for more sustainable cooling
Nature. 2020. Vol. 585, num. 7824, p. 211 – 216. DOI : 10.1038/s41586-020-2666.Co-designing electronics with microfluidics for more sustainable cooling
Nature. 2020. Vol. 585, num. 7824, p. 211 – 216. DOI : 10.1038/s41586-020-2666-1.Ultra-compact, high-frequency power integrated circuits based on GaN-on-Si Schottky Barrier Diodes
IEEE Transactions on Power Electronics. 2020. Vol. 36, num. 2, p. 1269 – 1273. DOI : 10.1109/TPEL.2020.3008226.Analysis of Large-Signal Output Capacitance of Transistors using SawyerâTower Circuit
IEEE Journal of Emerging and Selected Topics in Power Electronics. 2020. p. 1 – 1. DOI : 10.1109/JESTPE.2020.2992946.Comparison of Wide-band-gap Technologies for Soft-Switching Losses at High Frequencies
IEEE Transactions on Power Electronics. 2020. p. 1 – 1. DOI : 10.1109/TPEL.2020.2990628.Coss Loss Tangent of Field-Effect Transistors: Generalizing High-Frequency Soft-Switching Losses
IEEE Transactions on Power Electronics. 2020. Vol. 35, num. 12, p. 1 – 1. DOI : 10.1109/TPEL.2020.2990370.Efficient High Step-up Operation in Boost Converters Based on Impulse Rectification
IEEE Transactions on Power Electronics. 2020. p. 1 – 1. DOI : 10.1109/TPEL.2020.2982931.Nanoplasma-enabled picosecond switches for ultrafast electronics
Nature. 2020. Vol. 579, num. 7800, p. 534 – 539. DOI : 10.1038/s41586-020-2118-y.Negative Resistance in Cascode Transistors
IEEE Transactions on Power Electronics. 2020. p. 1 – 1. DOI : 10.1109/TPEL.2020.2978658.Multi-Channel AlGaN/GaN In-Plane-Gate Field-Effect Transistors
IEEE Electron Device Letters. 2020. Vol. 41, num. 3, p. 321 – 324. DOI : 10.1109/LED.2020.2967458.Fast-switching Tri-Anode Schottky Barrier Diodes for monolithically integrated GaN-on-Si power circuits
IEEE Electron Device Letters. 2020. Vol. 41, num. 1, p. 99 – 102. DOI : 10.1109/LED.2019.2957700.High-Accuracy Calibration-Free Calorimeter for the Measurement of Low Power Losses
IEEE Transactions on Power Electronics. 2020. p. 1 – 1. DOI : 10.1109/TPEL.2020.3001001.Efficient Microchannel Cooling of Multiple Power Devices with Compact Flow Distribution for High Power-Density Converters
IEEE Transactions on Power Electronics. 2020. Vol. 35, num. 7, p. 7235 – 7245. DOI : 10.1109/TPEL.2019.2959736.Conference Papers
Small-Signal Approach for Precise Evaluation of Gate Losses in Soft-Switched Wide-Band-Gap Transistors
2020. 2020 IEEE 21st Workshop on Control and Modeling for Power Electronics (COMPEL), Aalborg, Denmark, November 9-12, 2020. p. 1 – 5. DOI : 10.1109/COMPEL49091.2020.9265751.Calibration-Free Calorimeter for Sensitive Loss Measurements: Case of High-Frequency Inductors
2020. 2020 IEEE 21st Workshop on Control and Modeling for Power Electronics (COMPEL), Aalborg, Denmark, November 9-12, 2020. p. 1 – 8. DOI : 10.1109/COMPEL49091.2020.9265756.Output-Capacitance Hysteresis Losses of Field-Effect Transistors
2020. 2020 IEEE 21st Workshop on Control and Modeling for Power Electronics (COMPEL), Aalborg, Denmark, November 9-12, 2020. p. 1 – 8. DOI : 10.1109/COMPEL49091.2020.9265823.Embedded Microchannel Cooling for High Power-Density GaN-on-Si Power Integrated Circuits
2020. 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Orlando, FL, USA, USA, July 21-23, 2020. p. 53 – 59. DOI : 10.1109/ITherm45881.2020.9190356.Output Capacitance Losses in Wide-Band-Gap Transistors: A Small-Signal Modeling Approach
2020. 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD). p. 190 – 193. DOI : 10.1109/ISPSD46842.2020.9170093.Investigation of p-GaN tri-Gate normally-Off GaN Power MOSHEMTs
2020. 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD), Vienna, Austria, September 13-18, 2020. p. 345 – 348. DOI : 10.1109/ISPSD46842.2020.9170183.High-Frequency GaN-on-Si power integrated circuits based on Tri-Anode SBDs
2020. 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD), Vienna, Austria, Septembre 13-18, 2020. p. 517 – 520. DOI : 10.1109/ISPSD46842.2020.9170092.Mixed Simulation-Experimental Optimization of a Modular Multilevel Switched Capacitors Converter Cell
2020. IEEE 21st Workshop on Control and Modeling for Power Electronics (COMPEL), Aalborg, DENMARK, Nov 09-12, 2020. p. 883 – 888. DOI : 10.1109/COMPEL49091.2020.9265665.97.4%-Efficient All-GaN Dual-Active-Bridge Converter with High Step-up High-Frequency Matrix Transformer
2020. PCIM Europe digital days 2020, Online, July 7-8, 2020.Bringing the Heat Sink Closer to the Heat: Evaluating Die-embedded Microchannel Cooling of GaN-on-Si Power Devices
2020. 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), ELECTR NETWORK, 2020-09-14 – 2020-10-09. p. 18 – 24. DOI : 10.1109/THERMINIC49743.2020.9420501.Analysis of Output Capacitance Co-Energy and Discharge Losses in Hard-Switched FETs
2020. IEEE 9th International Power Electronics and Motion Control Conference (IPEMC-ECCE Asia), Nanjing, PEOPLES R CHINA, Nov 29-Dec 02, 2020. p. 52 – 59. DOI : 10.1109/IPEMC-ECCEAsia48364.2020.9367701.Theses
AlGaN/GaN Nanowires: from Electron Transport to RF Applications
Lausanne, EPFL, 2020.2019
Journal Articles
Broadband Zero-Bias RF Field-Effect Rectifiers Based on AlGaN/GaN Nanowires
IEEE Microwave and Wireless Components Letters. 2019. Vol. 30, num. 1, p. 66 – 69. DOI : 10.1109/LMWC.2019.2953632.New Insights on Output Capacitance Losses in Wide-Band-Gap Transistors
IEEE Transactions on Power Electronics. 2019. p. 1 – 1. DOI : 10.1109/TPEL.2019.2958000.H-terminated polycrystalline diamond p-channel transistors on GaN-on-Silicon
IEEE Electron Device Letters. 2019. p. 1 – 1. DOI : 10.1109/LED.2019.2953245.Near-junction heat spreaders for hot spot thermal management of high power density electronic devices
Journal of Applied Physics. 2019. Vol. 126, num. 16, p. 165113. DOI : 10.1063/1.5123615.Measurement of Large-Signal Coss and Coss Losses of Transistors Based on Nonlinear Resonance
IEEE Transactions on Power Electronics. 2019. p. 1 – 1. DOI : 10.1109/TPEL.2019.2938922.Impact of Fin Width on Tri-Gate GaN MOSHEMTs
IEEE Transactions on Electron Devices. 2019. Vol. 66, num. 9, p. 4068 – 4074. DOI : 10.1109/TED.2019.2925859.High-Voltage Normally-off Recessed Tri-Gate GaN Power MOSFETs With Low on-Resistance
IEEE Electron Device Letters. 2019. Vol. 40, num. 8, p. 1289 – 1292. DOI : 10.1109/LED.2019.2922204.GaN Transistors for Miniaturized Pulsed-Power Sources
IEEE Transactions on Plasma Science. 2019. Vol. 47, num. 7, p. 3241 – 3245. DOI : 10.1109/TPS.2019.2917657.On the Dynamic Performance of Laterally Gated Transistors
IEEE Electron Device Letters. 2019. Vol. 40, num. 7, p. 1171 – 1174. DOI : 10.1109/LED.2019.2920116.Enhanced transformation of sulfonamide antibiotics by manganese(IV) oxide in the presence of model humic constituents
Water Research. 2019. Vol. 153, p. 200 – 207. DOI : 10.1016/j.watres.2019.01.011.On-Chip High-Voltage Sensors Based on Trap-Assisted 2DEG Channel Control
IEEE Electron Device Letters. 2019. Vol. 40, num. 4, p. 613 – 615. DOI : 10.1109/LED.2019.2898043.High-performance nanowire-based E-mode Power GaN MOSHEMTs with large workfunction gate metal
IEEE Electron Device Letters. 2019. p. 1 – 1. DOI : 10.1109/LED.2019.2896359.Fully-vertical GaN-on-Si power MOSFETs
IEEE Electron Device Letters. 2019. Vol. 40, num. 3, p. 443 – 446. DOI : 10.1109/LED.2019.2894177.Enhanced DAB for Efficiency Preservation using Adjustable-Tap High-Frequency Transformer
IEEE Transactions on Power Electronics. 2019. p. 1 – 1. DOI : 10.1109/TPEL.2019.2958632.Conference Papers
1200 V Multi-Channel Power Devices with 2.8 Ωâąmm ON-Resistance
2019. 2019 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, USA, December 7-11, 2019. p. 4.1.1 – 4.1.4. DOI : 10.1109/IEDM19573.2019.8993536.High-performance normally-off tri-gate GaN power MOSFETs
2019. 2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD), Shanghai, China, 19-23 May 2019. p. 71 – 74. DOI : 10.1109/ISPSD.2019.8757690.Ultra-High Power Density Magnetic-less DC/DC Converter Utilizing GaN Transistors
2019. 2019 IEEE Applied Power Electronics Conference and Exposition (APEC), Anaheim, CA, USA, 17-21 March, 2019. p. 1609 – 1615. DOI : 10.1109/APEC.2019.8721783.A manifold microchannel heat sink for ultra-high power density liquid-cooled converters
2019. 34th Annual IEEE Applied Power Electronics Conference and Exposition (APEC), Anaheim, CA, Mar 17-21, 2019. p. 1383 – 1389. DOI : 10.1109/APEC.2019.8722308.High performance Fully-vertical GaN-on-Si power MOSFETs
2019. Compound Semiconductor Week (CSW) Conference, Nara, JAPAN, May 19-23, 2019. DOI : 10.1109/ICIPRM.2019.8819025.High-performance nanowire-based E-mode Power GaN MOSHEMTs
2019. Compound Semiconductor Week (CSW) Conference, Nara, JAPAN, May 19-23, 2019. DOI : 10.1109/ICIPRM.2019.8819328.Novel Slanted Field Plate Technology for GaN HEMTs by Grayscale Lithography on Flowable Oxide
2019. Compound Semiconductor Week (CSW) Conference, Nara, JAPAN, May 19-23, 2019. DOI : 10.1109/ICIPRM.2019.8818997.Theses
Tri-gate technologies for high-performance power GaN devices
Lausanne, EPFL, 2019.2018
Journal Articles
Multi-Channel Tri-gate GaN Power Schottky Diodes with Low ON-Resistance
IEEE Electron Device Letters. 2018. Vol. 40, num. 2, p. 275 – 278. DOI : 10.1109/LED.2018.2887199.Multi-channel tri-gate normally-on/off AlGaN/GaN MOSHEMTs on Si substrate with high breakdown voltage and low ON-resistance
Applied Physics Letters. 2018. Vol. 113, num. 24, p. 242102. DOI : 10.1063/1.5064407.Vertical GaN-on-Si MOSFETs With Monolithically Integrated Freewheeling Schottky Barrier Diodes
IEEE Electron Device Letters. 2018. Vol. 39, num. 7, p. 1034 – 1037. DOI : 10.1109/LED.2018.2841959.GaN-on-Si Quasi-Vertical Power MOSFETs
IEEE Electron Device Letters. 2018. Vol. 39, num. 1, p. 71 – 74. DOI : 10.1109/LED.2017.2779445.1100 V AlGaN/GaN MOSHEMTs With Integrated Tri-Anode Freewheeling Diodes
IEEE Electron Device Letters. 2018. Vol. 39, num. 7, p. 1038 – 1041. DOI : 10.1109/LED.2018.2842031.820 V GaN-on-Si Quasi-Vertical P-i-N Diodes with BFOM of 2.0 GW/cm2
IEEE Electron Device Letters. 2018. Vol. 39, num. 3, p. 401 – 404. DOI : 10.1109/LED.2018.2793669.Electromechanics of suspended spiral capacitors and inductors
Applied Physics Letters. 2018. Vol. 112, p. 031906. DOI : 10.1063/1.5012867.2âkV slanted tri-gate GaN-on-Si Schottky barrier diodes with ultra-low leakage current
Applied Physics Letters. 2018. Vol. 112, num. 5, p. 052101. DOI : 10.1063/1.5012866.Conference Papers
High Step-Up High-Frequency Zero-Voltage Switched GaN-Based Single-Stage Isolated DC-DC Converter for PV Integration and Future DC Grids
2018. PCIM Europe 2018; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, Germany,645 V quasi-vertical GaN power transistors on silicon substrates
2018. 30th IEEE International Symposium on Power Semiconductor Devices and ICs (ISPSD), Chicago, IL, May 13-17, 2018. p. 240 – 243. DOI : 10.1109/ISPSD.2018.8393647.Uni-directional GaN-on-Si MOSHEMTs with high reverse-blocking voltage based on nanostructured Schottky drain
2018. 30th IEEE International Symposium on Power Semiconductor Devices and ICs (ISPSD), Chicago, IL, May 13-17, 2018. p. 192 – 195. DOI : 10.1109/ISPSD.2018.8393635.Monolithic integration of GaN-based NMOS digital logic gate circuits with E-mode power GaN MOSHEMTs
2018. 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD), Chicago, USA, May 13-17, 2018. p. 236 – 239. DOI : 10.1109/ISPSD.2018.8393646.Patents
Semiconductor devices with multiple channels and three-dimensional electrodes
EP3539159; US10985253; EP3539159; US2019267454; WO2018087728.
2018.Semiconductor device comprising a three-dimensional field plate
US11476357; EP3520142; EP3520142; US2019229208; WO2018060918.
2018.