Projects

Semester project

Environmental mechanical cues—like adhesion, tension, stiffness, shear, viscoelasticity, plasticity, pressure, and confinement—impact cells in many ways. Mechanobiology focuses on how physical forces and the mechanical properties of cells and tissues influence their overall biological functions. When looking at organoid mechanobiology, there is currently a lack of studies that perform detailed, dynamic analyses of nervous system changes within 3D structures undergoing mechanical deformation.

The primary goal of this project is to systematically investigate how the physical properties of the active anchoring membrane—specifically membrane perforation size, geometry, thickness, and material composition—affect organoid integration and mechanobiological outcomes. The student will evaluate different polymers, such as Polyimide (PI) and PDMS, and will be responsible for fabricating these customized membranes, assembling organoid housing, seeding actual brain organoids, and executing active strain protocols coupled with extensive optical imaging.

Project Goals

• Device Fabrication

  • Gain hands-on experience in cleanroom microfabrication to systematically create micropatterned perforated membranes using polymers like PI and PDMS
  • Fabricate, assemble, and sterilize PMMA organoid housings designed for mechanical actuation

  Biological Integration and Tissue Culture

  • Learn and apply specialized cell culture techniques to seed and anchor 3D brain organoids onto the fabricated membranes
  • Assess how different perforation geometries and coating strategies (e.g., Matrigel) influence tissue growth and mechanical anchoring

  Mechanobiology Testing

  • Operate a custom mechanical actuation system to apply precise, controlled dynamic stretching to the biological samples
  • Evaluate how variations in membrane thickness and polymer elasticity dictate the transfer of physical strain directly to the cellular network

Imaging and Data Analysis

• • Perform extensive fluorescence imaging (e.g., live/dead assays) before, during, and after mechanical loading to assess tissue viability and structural integrity
  • Analyze optical data to quantitatively evaluate the physical response of the organoid to the applied mechanical stress

Must-Have Skills

• Strong motivation and curiosity in mechanobiology, organoid technology, and microfabrication
• Basic knowledge of polymers and a willingness to learn microfabrication processes
• Interest in experimental troubleshooting, hands-on device assembly, and independent research

Nice-to-Have Skills

• Experience with cleanroom microfabrication (e.g., photolithography, spin coating, etching, mico-molding).
• Familiarity with cell culture, ideally with 3D organoids or sterile biological environments
• Exposure to fluorescence microscopy and image data processing (e.g., ImageJ, Python, MATLAB).

To apply, please contact Sajjad Mirbakht

Semester project

Soft flexible arrays embedding microLEDs are emerging as a key tool for in vivo optogenetic stimulation of neural tissue. Precise delivery of light to biological targets requires careful management of the thermal load imposed on surrounding tissue, as excessive heating can compromise both device performance and biological safety. This project, at the intersection of photonics, thermal engineering, and neuroengineering, aims to identify optimal device designs and stimulation protocols that achieve the desired optical irradiance within the target tissue while minimizing heating. To this end, the student will develop and refine thermal models in COMSOL Multiphysics and implement an iterative optimization pipeline to define the best parameters based on target irradiance values.

Project Goals

• Build high-fidelity thermal models of soft microLED arrays in biological tissue using COMSOL Multiphysics, capturing coupled optical-thermal behavior under realistic stimulation conditions.
• Identify optimal device geometries and stimulation protocols (duty cycle, pulse width, power) that achieve the desired optical irradiance inside the target tissue while keeping temperature rise within safe limits.
• Develop an iterative optimization pipeline that automatically maps required irradiance levels to device parameters, accounting for tissue-specific optical and thermal properties.
• Validate modelling outputs against experimental benchmarks and translate findings into actionable design guidelines for future device generations.

Must-Have Skills

• Experience with COMSOL Multiphysics
• Solid background in heat transfer and thermal modelling fundamentals
• Basic understanding of photonics or optics (light propagation, irradiance)
• Programming experience in MATLAB, Python, or similar for post-processing and automation
• Strong analytical mindset with attention to model validation

Nice-to-Have Skills

• Prior exposure to bioelectronics, neural interfaces, or optogenetics
• Experience with soft or flexible electronics fabrication
• Experience using COMSOL LiveLink for MATLAB for simulation automation
• Familiarity with optimization algorithms
• Interest in experimental validation alongside modelling work

To apply, please contact Luca Liebi or Kai Zhu

Semester project

This project focuses on developing and optimizing a bioprinting process to pattern a sacrificial stiffening layer onto an advanced peripheral nerve cuff with high–aspect-ratio microneedles. The coating is designed to temporarily support and protect the microneedles during implantation, when the cuff must wrap around the nerve and is exposed to tangential forces that could bend or damage the structures.

The sacrificial layer provides short-term mechanical support and protection during handling and implantation, and subsequently dissolves in biological fluids to allow the microneedles to self-insert within the nerve. The student will establish and refine an extrusion bioprinting workflow to reliably deposit this layer with high precision and reproducibility. Initial work will be carried out on dummy substrates and, depending on progress, may extend to functional neural interfaces.

Project Goals

• Operate and Understand the Extrusion Bioprinter

• • Learn the full workflow of an extrusion-based bioprinter.
  • Study how printing parameters (extrusion rate, printhead speed, nozzle diameter) affect print result and repeatability.
  • Test different options for substrate preparation to improve the prints

• Optimize the Sacrificial Printing Solution: Create and refine formulations that are:
  • easy to extrude and capable of high-resolution printing,
  • mechanically stiff once solidified to effectively protect the needles during implantation,
  • fully water-soluble to allow dissolution and subsequent self-insertion.
• Design and Optimize Printing Patterns
  • Use CAD and slicing tools to design printing patterns that align with microneedle geometry.
  • Tune pattern geometry (e.g., line spacing, layer height) and post-processing steps to achieve consistent coverage and protective shape.
• Morphological and Structural Analysis
  • Characterize printed features using optical microscopy and SEM.
  • Evaluate fidelity, uniformity, spreading, drying behavior, and adhesion.
• Dissolution and Functional Performance
  • Measure dissolution kinetics in aqueous or physiological buffers.
  • Optionally perform mechanical bench tests to assess whether the printed layer effectively stabilizes the needles under tangential forces.

Must-Have Skills

• Strong motivation and curiosity in bioelectronics, neural interfaces, and flexible electronics.
• Basic understanding of neural interfaces and 3D printing techniques.
• Interest in hands-on experimental work, data analysis, and iterative problem-solving.

Nice-to-Have Skills

• Basic knowledge of hydrogels, polymers or fluid rheology.
• Experience with CAD/slicing/g-code for 3D printing.
• Exposure to optical microscopy or SEM.

To apply, please contact Angela Braccia or Scott Erickson

Semester project

This project focuses on understanding the long-term electrochemical stability of PEDOT-coated active sites in a novel peripheral nerve interface. PEDOT (poly(3,4-ethylenedioxythiophene)) is a widely used conducting polymer in neural implants due to its excellent electrochemical properties and biocompatibility. However, its structural and functional degradation—especially under prolonged electrical stimulation—remains a critical barrier to reliable long-term implantation.

The primary goal of this project is to evaluate the range of stimulation currents that can be safely applied without compromising the integrity of the PEDOT coating, while also studying how in vivo-like mechanical and chemical conditions contribute to its degradation or delamination. This includes assessing electrical fatigue, chemical aging, and mechanical stress, with the ultimate goal of improving implant longevity.

Project Goals

• Device Fabrication
  Gain some hands-on experience, assisting in device fabrication.
• PEDOT Deposition
  Learn and apply electrochemical polymerization techniques to deposit PEDOT on electrode surfaces.
• Electrochemical and Physical Characterization
  • Use electrochemical impedance spectroscopy (EIS) and cyclic voltammetry (CV) to assess coating properties.
  • Quantify charge injection capacity, impedance stability, and surface integrity over time.
• Aging and Stress Testing
  • Apply prolonged electrical stimulation protocols at varying current levels to evaluate electrochemical fatigue.
  • Conduct passive chemical aging in PBS at physiological or elevated temperatures to simulate in vivo conditions.
  • Perform mechanical stress tests, including:
    • Ultrasonic agitation (sonication).
    • Insertion into explanted nerve tissue to evaluate mechanical resilience and adhesion during penetration.
• Failure and Adhesion Analysis
  • Analyze degradation using electrochemical measurements and scanning electron microscopy (SEM).
  • Identify signs of delamination, cracking, or coating detachment, which may indicate adhesion issues.

Must-Have Skills

• Strong motivation and curiosity in neural interfaces and bioelectronics.
• Basic knowledge of microfabrication and cleanroom processes.
• Interest in experimental troubleshooting and independent research.

Nice-to-Have Skills

• Experience with cleanroom microfabrication (e.g., photolithography, sputtering, etching).
• Familiarity with electrochemical or mechanical testing platforms.
• Exposure to microscopy techniques (optical, SEM)

To apply, please contact Angela Braccia

Semester project

This project aims to advance neural interface technology by exploring the integration of a commercial high-channel recording chip (the Nixel 512 chip from Science Corporation) with the soft, flexible implantable arrays developed at the Laboratory for Soft Bioelectronic Interfaces (LSBI). Utilizing flip-chip bonding, we will integrate a high-performance silicon recording chip with our soft electrode arrays, offering an avenue to increase the density and channel count of our devices.

The project will focus on the fabrication and characterization of implantable electrocorticography (ECoG) arrays incorporating the Nixel chips.

Project Goals:

• Cleanroom Microfabrication:
  • Fabricate the high-density electrode arrays.
  • Optimize the flip-chip bonding of bare dies onto thin-film polymeric substrates, adapted to the selected chip.
• Characterization:
  • Characterize electrically and electrochemically the performance of fabricated devices.
  • Assess the reliability of the flip-chip bonding process with the selected chip.

Must-have Competencies:

• Strong motivation and interest in the development of novel neural interfaces for biomedical applications.
• Theoretical knowledge of standard microfabrication and photolithography processes.
• Strong understanding of electrophysiology and the basics of bioelectronic interfaces.
• Good problem-solving skills and an ability to work independently within an interdisciplinary team environment.

Nice-to-have Competencies:

• Experience working in a cleanroom environment.
• Experience in bench testing of neural interfaces.

To apply (or for more information): Horacio Londoño Ramírez

Semester project/Master Thesis

This project tackles one of the core challenges in advanced neural engineering: developing reliable, low-impedance, and mechanically robust electrical connections between high-channel-count silicon microchips and soft implantable substrates.

In this project, you will explore and optimize microbump-based flip-chip bonding strategies to integrate high-density microchips onto flexible thin-film platforms. These interconnects are essential to enable chronic implants capable of recording from thousands of neural channels.

You will work hands-on in the cleanroom, developing processes for the realization, optimization, and characterization of metal microbumps, assessing how their geometry, material, and bonding method affect their electrical and mechanical performance.

If you’re passionate about microfabrication, neurotechnology, and solving engineering problems that directly impact the future of brain-computer interfaces, this is your project.

Project Goals

• Fabricate microbumps using electrodeposition or stencil printing on flexible polymeric substrates and/or silicon dies.
• Compare different materials (e.g., copper, gold) and bump geometries for bonding suitability.
• Explore bonding methods (thermal compression, ultrasonic, reflow) and their impact on bump quality.
• Measure impedance and resistance of microbump interconnects across channel arrays.
• Evaluate mechanical reliability through shear tests, adhesion, and fatigue cycles.
• Perform post-bonding inspection via profilometry, microscopy, and electrical continuity tests.
• Assess the feasibility of scaling the interconnect technology to >1000 channels.
• Analyze signal integrity and contact yield across dense arrays.

Must-Have skills

• Strong interest in microfabrication, electronics packaging, or neural engineering.
• Basic knowledge of cleanroom processes and electrical characterization.
• Solid problem-solving skills and a detail-oriented approach to experimental work.
• Willingness to work independently and iterate on experimental designs..

Nice-to-Have skills

• Experience with wire bonding, flip-chip bonding, or electrodeposition.
• Familiarity with tools like SEM, profilometer, or impedance analyzers.
• Background in microelectrode arrays or neural signal acquisition.

To apply, please contact Pietro Palopoli

Semester project

This full-time summer semester project invites you to explore the power of electrodeposition to fabricate high-performance metal structures, such as antennas, inductive coils, and microbumps, for next-generation soft bioelectronic systems.

In this project, you will develop and optimize electrodeposition protocols to realize functional coils and antennas for wireless power transfer and communication. In parallel, you will work on the electrodeposition of microbumps for flip-chip bonding, an essential process for connecting active electronics to soft, implantable substrates.

You will gain hands-on experience in cleanroom microfabrication and characterization techniques, learning how to control metal morphology, thickness, and performance to meet stringent requirements in flexible and biointegrated electronics.

If you are excited about working at the interface of microsystems engineering, bioelectronics, and wireless communication, this is a unique opportunity to build foundational skills in a highly active research area.

Project Goals

• Optimize copper and gold electrodeposition for fabricating thin-film antennas, inductive coils, microbumps.
• Tune parameters such as current density, plating time, mask geometry, and agitation for thicknesses ranging from 2 to 30 µm.
• Assess the electrical and functional outcome of your production.
• Apply standard cleanroom processes (polyimide processing, photolithography, lift-off, laser cutting).
• Integrate metal structures into coil or antenna layouts for test and validation.
• Prepare test platforms for electrical interfacing and packaging.
• Measure electrical and RF performance (e.g., S11/S21 via vector network analyzer, resistance, and inductance).
• Analyze metal morphology and roughness (optical profilometry, SEM).

Must-Have skills

• Strong motivation to learn microfabrication techniques and work in a cleanroom environment.
• Basic knowledge of materials science, electrochemistry, or electrical engineering.
• Interest in wireless power transfer, flexible electronics, or implantable systems.
• Curiosity and self-initiative in experimental troubleshooting.

Nice-to-Have skills

• Experience with cleanroom tools (spin-coating, mask aligner, profilometer, etc.).
• Knowledge of electrochemical deposition or RF testing (e.g., VNAs).
• Familiarity with MATLAB/Python for data analysis.

To apply, please contact Pietro Palopoli

Semester project / Master Thesis

This project invites you to the cutting edge of neurotechnology: building ultra-flexible, wireless neural interfaces through microfabrication of thin-film antennas and power coils. The ultimate goal? A fully implantable ECoG platform for small animal models—without bulky connectors or rigid PCBs.

In the previous semester, we successfully fabricated and tested thin-film coils and antennas for wireless power and communication. We explored RF performance, biocompatible materials, and design trade-offs to develop coils and antennas that are both highly functional and extremely flexible.

In the next stage, we will push the limits of wireless design: integrating optimized power coils and Bluetooth-compatible antennas directly into soft, implantable substrates, ready to be connected with active electronics.

If you’re excited by the idea of combining microfabrication, wireless systems, and soft neurotechnology to create the future of brain-computer interfaces, this project is for you.

Project Goals

• Refine the design of flexible single-layer and multilayer coils for wireless power transfer at ~13.56 MHz.
• Improve antenna layout and matching networks for operation in the Bluetooth band (2.4–2.5 GHz).
• Fabricate devices using polyimide-based thin-film technology with micron-level copper thickness.
• Optimize process flow for via-hole fabrication and encapsulation (Ecoflex or multilayer coatings).
• Realize streatchable coils and assess their functionality
• Measure RF performance (S11/S21) of fabricated structures using vector network analyzers and in-tissue phantoms.
• Validate power transfer capability and electromagnetic coupling using LED load tests and impedance matching.
• Evaluate mechanical properties and perform bending/fatigue tests using standardized protocols.
• Integrate the coils/antennas with functional Bluetooth modules.

Must-Have skills

• Motivation to work at the intersection of microfabrication, wireless electronics, and neurotechnology.
• Basic Understanding of electrical engineering and RF principles.
• Familiarity with cleanroom processes and photolithography.
• Basic knowledge of neural interfaces or soft electronics..

Nice-to-Have skills

• Microfabrication experience.
• Prior work on PCB or antenna design (e.g., ADS, HFSS, Sim4Life).
• Familiarity with simulation tools (COMSOL)
• Familiarity with firmware programming

To apply, please contact Pietro Palopoli

Master Thesis / Semester project

This project focuses on the development of flexible Field Effect Transistor (FET)-based sensors designed for biosensing neural signals, including neurotransmitters and other biomarkers such as metabolites or proteins relevant to neural activity. The goal is to enhance neural signal recordings with biochemical insights, offering a better understanding of the neural microenvironment and advancing neuroprosthetics, diagnostics, and bioelectronic medicine.

Project Goals:

• Design and Fabrication:
  • Develop flexible FET-based sensors with high sensitivity for neural biomarkers.
  • Optimize the fabrication process for reproducibility.
• Surface Functionalization:
  • Test the stability and selectivity of functionalized sensors under different conditions.
• Electrical and Biochemical Characterization:
  • Evaluate sensor performance parameters such as sensitivity, limit of detection, and response time.
• Application in Neural Biosensing:
  • Demonstrate the potential of these sensors to complement neural signal recordings by detecting key neurotransmitters (e.g., dopamine, glutamate) or other biomarkers associated with neural activity.

Must-Have skills:

• Motivation and interest in applying biosensors in neuroscience and other biomedical applications.
• Basic understanding of Field Effect Transistor (FET) principles and biosensor mechanisms.
• Familiarity with neurophysiology, including biomarkers and their significance in neural processes.
• Team-oriented and collaborative mindset.

Nice-to-Have skills:

• Experience with microfabrication techniques and cleanroom processes.
• Knowledge of bioreceptor immobilization strategies (e.g., covalent bonding, adsorption).
• Familiarity with sensor testing in different media (e.g., buffers, biological fluids).
• Understanding of materials science, especially in the context of flexible and biocompatible substrates.
• Knowledge of CAD software and 3D printing for sensor integration and packaging.

References:

Zhao, C., Cheung, K. M., Huang, I.-W., Yang, H., Nakatsuka, N., Liu, W., Cao, Y., Man, T., Weiss, P. S., Monbouquette, H. G., & Andrews, A. M. (2021). Implantable aptamer–field-effect transistor neuroprobes for in vivo neurotransmitter monitoring. Science Advances, 7(48), eabj7422. https://doi.org/10.1126/sciadv.abj7422

To apply, please contact: Desirée Maulá

Students applying for internships must either be awarded credits for their work (e.g. master thesis) or provide their own funding (e.g. non-credited summer internship).

Registered EPFL bachelor and master students

You should organise your agenda to be on site, in Geneva, for at least a full day per week. The travel costs between EPFL Lausanne and EPFL Geneva will be covered.

External students from a partner University

The list of partner universities can be found here. To join the LSBI, you should register first through EPFL academic services – please check the following website for additional information.

External students from a non-partner University

You are welcome to apply to join the LSBI, but you will need to find your own funding source e.g. a scholarship, a grant, etc.

Fellowships

Foreign students are welcome to apply to one of the following schemes to join the LSBI for a summer, a semester or a year-long internship.

EPFL Excellence in Engineering, E3 program for Summer internship

Zeno Karl Schindler Summer School grant

Swiss Government Excellence Fellowship