Category: thermalsoc

3D-ICE version 4.0 is out

We are excited to share the release of 3D-ICE 4.0, the newest version of our 3D Interlayer Cooling Emulator, which can deliver more accurate and efficient thermal modeling for modern 2.5D/3D heterogeneous chiplet systems. 3D-ICE 4.0 supports modeling detailed material distribution across layers, directly imported from industrial layouts. To handle complex multi-layer stacks, 3D-ICE introduces (…)

Chips from a higher dimension: the next generation of generative AI computing

For many years, Prof. John Thome of the Institute of Mechanical Engineering pioneered the use of heat sensing technology, and collaborated with Prof. David Atienza of the Institute of Electrical Engineering to model ways in which 3D chips could be cooled efficiently, using techniques like micro-channels of liquids. This work has been further developed as (…)

Cooling down hotspots – 3D-ICE

3D chips are a great idea – processors placed one on top of the other, for a superfast transmission of data. The trouble is that chips heat up, and if you pile them up they heat up even faster. 3D-ICE is a powerful thermal emulator for three-dimensional computing. Version 3.1 is presented in a new (…)

ACM Fellow Prof. Atienza: Shaping Sustainable Computing & Edge AI

David Atienza, director of the EPFL EcoCloud Center, was interviewed by the organisation Association for Computer Machinery (ACM) on the occasion of a presentation that he gave as a Distinguished Speaker and Fellow. Here is a summary of that conversation. While a core focus of your research has been embedded systems, you have branched out (…)

Thermosyphon – a true Innovation

Innovations developed by our lab have been analysed by the European Commission’s Innovation Radar (see mission statement). One of the researchers involved, Arman Iranfar, explains this ground-breaking technology. Nowadays, data centers with large rooms are filled with a huge number of servers and other IT equipment that account for around 2% of the global energy (…)

ThermoSyphon

ISVLSI 2020 Best Paper Award!

Congratulations to Halima Najibi, Alexandre Levisse, Marina Zapater and David Atienza for winning a best paper award at the IEEE Computer Society Annual Symposium on VLSI. The online presentation: The entire award ceremony: