We are excited to share the release of 3D-ICE 4.0, the newest version of our 3D Interlayer Cooling Emulator, which can deliver more accurate and efficient thermal modeling for modern 2.5D/3D heterogeneous chiplet systems.
3D-ICE 4.0 supports modeling detailed material distribution across layers, directly imported from industrial layouts.
To handle complex multi-layer stacks, 3D-ICE introduces adaptive layer partitioning and thermal-aware non-uniform meshes to better capture temperature gradients while balancing accuracy and runtime. In addition, multi-thread acceleration (OpenMP + a multi-threaded sparse solver) is employed in 3D-ICE for thermal modeling of large-scale systems.
K. Zhu, D. Huang, L. Costero, D. Atienza, 3D-ICE 4.0: Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet system, 2026 Design, Automation and Test in Europe Conference (DATE) [PDF]
