UniTemp RSS

Mini Reflow Solder System UniTemp RSS-450-110

Mini Reflow Solder System UniTemp RSS-450-110

System Configuration

  • Heating: 150°C/min (max 450°C)
  • Cooling: 120°C/min
  • Gas: forming gas N2(92%)-H2(8%)
  • Pumping system: atmospheric pressure to 5 mbar
  • Plate size: 110mm x 110mm