The assembly of components is one of the activities proposed by the ACI. Thanks to our equipment we are able to accurately place components starting from chipsize 0201 up to Fine Pitch and BGA components.
With our vapor phase machine we offer superior solder quality with no overheating of components.
We can also carry out Rework operations of the most advanced packages, including SMDs, BGAs, CSPs, QFNs, LEDs, Flip-chips, 0201-01005s and all lead-free applications.
A financial contribution will be asked by the Printed Circuit Board Manufacturing Workshop (ACI) to cover the consumables and the maintenance costs of the equipment.