JFP Model 100 – 4 inches Wafer Scriber/Breaker

Scribing Head

  • Z motion with adjustable angle
  • Adjustable scribing force from 3gr up to 50gr; constant weight
  • Diamond Tool: Adjustable for angle & rotation
  • Tool Offset with cross-hair

 

Wafer Table

  • Wafer chuck till 4’’
  • Die Size: Minimum 200um square up to 10mmx10mm
  • Wafer thickness: 100um and up
  • Rotation alignment by micrometric screw
  • X Y Table / resolution 1um
  • Manual rotation 90 degrees
  • Motion control with progressive joystick weight

 

Vision System

  • Optics & magnification compatible with application (1 to 4x)
  • Alignment: Programmable area / Manual
  • Target generator

 

Breaker

  • Break mode: operator control or automatic
  • Breaking mode: Using top Mylar surface and bottom cutter
  • Mylar: removable to avoid contamination
  • Target generator

 

Parameters

  • Step Index
  • Y scribe speed from 0.1 to 20 mm/sec
  • Scribing length programmable
  • Repeat scribe
  • Number of scribe
  • Component number
  • Touchdown speed
  • Cutter speed