Following ebeam resists are currently available to users at CMi. Only these resists are authorized to be exposed in the Raith EBPG5000 tool, and to be processed on the processing equipment in zone 7 of CMi cleanroom. Please, do not introduce any other material without consulting CMi staff first.
Positive tone. Polymer. Primarily used for lift-off, primary choice for wet etch, can be used for dry etch as well.
Positive tone. Polymer. Primarily used for dry etch. Better resistance to dry etch than PMMA.
Positive tone. Polymer. Primarily used for dry etch. ZEP alternative.
Negative tone. Essentially liquid silicon dioxide that hardens by ebeam exposure or high temperature bake. Primarily used for dry etch.
Negative tone. Polymer. Chemically amplified. Primarily used for etch. Limited resolution. Sensitive also to light, can be used for mix&match with photolithography.
Conductive polymer coating. Used to remove charge during exposure from thin non-conductive films on otherwise conductive substrates. NOT a sufficient substitute for a proper metal coating on bulk non-conductive substrates!