Protel Design System Design Rule Check
PCB File : G:\PCB_final\PCB.PcbDoc
Date     : 07/01/2013
Time     : 11:07:10

WARNING: Multilayer Pads with 0 size Hole found
   Pad U2-7(260.3mm,142.9mm)  Multi-Layer

Processing Rule : Clearance Constraint (Gap=0.254mm) (InPolygon),(All)
Rule Violations :0

Processing Rule : Clearance Constraint (Gap=0.15mm) (All),(All)
Rule Violations :0

Processing Rule : Width Constraint (Min=0.2mm) (Max=5mm) (Preferred=0.5mm) (All)
Rule Violations :0

Processing Rule : Power Plane Connect Rule(Relief Connect )(Expansion=0.508mm) (Conductor Width=0.254mm) (Air Gap=0.254mm) (Entries=4) (All)
Rule Violations :0

Processing Rule : Short-Circuit Constraint (Allowed=No) (All),(All)
   Violation between Via (172.025mm,90.1mm) Top Layer to Bottom Layer and 
                     Pad U5-33(173.225mm,91.3mm)  Top Layer
   Violation between Via (172.025mm,92.5mm) Top Layer to Bottom Layer and 
                     Pad U5-33(173.225mm,91.3mm)  Top Layer
   Violation between Via (173.225mm,90.1mm) Top Layer to Bottom Layer and 
                     Pad U5-33(173.225mm,91.3mm)  Top Layer
   Violation between Via (173.225mm,92.5mm) Top Layer to Bottom Layer and 
                     Pad U5-33(173.225mm,91.3mm)  Top Layer
   Violation between Via (172.025mm,91.3mm) Top Layer to Bottom Layer and 
                     Pad U5-33(173.225mm,91.3mm)  Top Layer
   Violation between Via (173.225mm,91.3mm) Top Layer to Bottom Layer and 
                     Pad U5-33(173.225mm,91.3mm)  Top Layer
   Violation between Via (174.425mm,90.1mm) Top Layer to Bottom Layer and 
                     Pad U5-33(173.225mm,91.3mm)  Top Layer
   Violation between Via (174.425mm,92.5mm) Top Layer to Bottom Layer and 
                     Pad U5-33(173.225mm,91.3mm)  Top Layer
   Violation between Via (174.425mm,91.3mm) Top Layer to Bottom Layer and 
                     Pad U5-33(173.225mm,91.3mm)  Top Layer
   Violation between Via (260.675mm,142.9mm) Top Layer to Bottom Layer and 
                     Pad U2-7(260.3mm,142.9mm)  Multi-Layer
   Violation between Via (259.925mm,142.9mm) Top Layer to Bottom Layer and 
                     Pad U2-7(260.3mm,142.9mm)  Multi-Layer
   Violation between Via (186.375mm,102.75mm) Top Layer to Bottom Layer and 
                     Pad U4-29(186.975mm,104.55mm)  Bottom Layer
   Violation between Via (186.375mm,105.15mm) Top Layer to Bottom Layer and 
                     Pad U4-29(186.975mm,104.55mm)  Bottom Layer
   Violation between Via (186.375mm,106.35mm) Top Layer to Bottom Layer and 
                     Pad U4-29(186.975mm,104.55mm)  Bottom Layer
   Violation between Via (187.575mm,102.75mm) Top Layer to Bottom Layer and 
                     Pad U4-29(186.975mm,104.55mm)  Bottom Layer
   Violation between Via (187.575mm,105.15mm) Top Layer to Bottom Layer and 
                     Pad U4-29(186.975mm,104.55mm)  Bottom Layer
   Violation between Via (187.575mm,106.35mm) Top Layer to Bottom Layer and 
                     Pad U4-29(186.975mm,104.55mm)  Bottom Layer
   Violation between Via (186.375mm,103.95mm) Top Layer to Bottom Layer and 
                     Pad U4-29(186.975mm,104.55mm)  Bottom Layer
   Violation between Via (187.575mm,103.95mm) Top Layer to Bottom Layer and 
                     Pad U4-29(186.975mm,104.55mm)  Bottom Layer
   Violation between Via (185.175mm,102.75mm) Top Layer to Bottom Layer and 
                     Pad U4-29(186.975mm,104.55mm)  Bottom Layer
   Violation between Via (185.175mm,105.15mm) Top Layer to Bottom Layer and 
                     Pad U4-29(186.975mm,104.55mm)  Bottom Layer
   Violation between Via (185.175mm,106.35mm) Top Layer to Bottom Layer and 
                     Pad U4-29(186.975mm,104.55mm)  Bottom Layer
   Violation between Via (188.775mm,102.75mm) Top Layer to Bottom Layer and 
                     Pad U4-29(186.975mm,104.55mm)  Bottom Layer
   Violation between Via (188.775mm,105.15mm) Top Layer to Bottom Layer and 
                     Pad U4-29(186.975mm,104.55mm)  Bottom Layer
   Violation between Via (188.775mm,106.35mm) Top Layer to Bottom Layer and 
                     Pad U4-29(186.975mm,104.55mm)  Bottom Layer
   Violation between Via (185.175mm,103.95mm) Top Layer to Bottom Layer and 
                     Pad U4-29(186.975mm,104.55mm)  Bottom Layer
   Violation between Via (188.775mm,103.95mm) Top Layer to Bottom Layer and 
                     Pad U4-29(186.975mm,104.55mm)  Bottom Layer
Rule Violations :27

Processing Rule : Un-Routed Net Constraint ( (All) )
Rule Violations :0

Processing Rule : Hole Size Constraint (Min=0.3mm) (Max=6.2mm) (All)
Rule Violations :0

Processing Rule : Height Constraint (Min=0mm) (Max=25.4mm) (Prefered=12.7mm) (All)
Rule Violations :0

Processing Rule : Hole To Hole Clearance (Gap=0.254mm) (All),(All)
Rule Violations :0

Processing Rule : Minimum Solder Mask Sliver (Gap=0.15mm) (Disabled)(All),(All)
Rule Violations :0

Processing Rule : Silkscreen Over Component Pads (Clearance=0.254mm) (Disabled)(All),(All)
Rule Violations :0

Processing Rule : Silk to Silk (Clearance=0.254mm) (Disabled)(All),(All)
Rule Violations :0

Processing Rule : Net Antennae (Tolerance=0mm) (All)
Rule Violations :0


Violations Detected : 27
Time Elapsed        : 00:00:01